Cellulose-based encapsulation for all-printed flexible thermoelectric touch detectors

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2024-12-20 DOI:10.1007/s10854-024-14064-4

Joana Figueira, Mariana Peixoto, Cristina Gaspar, Joana Loureiro, Rodrigo Martins, Emanuel Carlos, Luís Pereira

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引用次数: 0

Abstract

Printed and flexible electronics have gained considerable scientific attention in recent years, driving the demand for low-energy production techniques, eco-friendly materials and flexible substrates. However, effective encapsulation is essential to protect these devices in harsh environmental conditions. Thus, sustainable encapsulant materials are critical for advancing flexible electronics. In this work, we studied three encapsulant materials—commercial plastic, polyvinyl alcohol and ethyl cellulose—applied to thermoelectric touch sensors printed on paper and fabric substrates. Ethyl cellulose demonstrated promising properties in terms of flexibility, water resistance and transparency, along with a low carbon footprint. Encapsulated substrates with ethyl cellulose exhibited high contact angles (121° on fabric and 116° on paper), indicating robust water repellency. Thermal stability tests showed minimal mass loss (10%) at 315 °C, confirming its temperature resilience. Furthermore, sensors encapsulated with ethyl cellulose retained their electric performance after water submersion for 1 min and withstood 100 bending cycles, maintaining response times below 1 s and signal output around 100 µV. These findings highlight ethyl cellulose as a viable green encapsulant material compatible with large-scale sustainable electronics manufacturing.

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.