Double-Beam Cantilever Probe for Crack Probability Analysis of Multilayer Substrates During Wafer Probing

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
F. Tremmel;O. Nagler;C. Kutter;R. Holmer
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Abstract

During wafer testing, small probes are contacting pads on the wafer surface to check the chip functionality and identify faulty dies. To prevent damaging structures underneath, a mechanical load limit needs to be defined. This is done by intentionally overstressing the pads and searching for cracks that appear. A customized test bench with a patented sensor-indenter (SI) system is currently used to perform the contact cycles and identify crack formations in real time using the generated acoustic emissions (AEs). This method is faster and more accurate compared with previous optical detection methods. This article presents an improved version of the SI system usable in a wafer prober, featuring a double-beam cantilever beam with an exchangeable indenter tip. This leads to measurement conditions closer to productive wafer testing, enabling more accurate load limit definitions. The cantilever beam contains a strain gauge Wheatstone bridge for contact force measurement and a piezoelectric sensor element for AE signal detection. Amplifier circuits are designed for both sensors, and a data acquisition (DAQ) system is developed. A prototype of the sensor cantilever combination (SCC) is shown together with simulated and experimental results. The accuracy of the force sensor ( $\pm 0.5~{\rightarrow }~\pm 1.3$ mN) and the signal-to-noise ratios (SNRs) of the AE signals ( $29.1~{\rightarrow }~21$ dB) show only a small decrease compared with the previous SI system. A crack probability analysis of a test specimen confirms the usability of the SCC, as AE crack signals are detected at a similar mechanical load with both sensor setups.
双梁悬臂探头用于晶圆探测过程中多层衬底的裂纹概率分析
在晶圆测试期间,小探针接触晶圆表面的衬垫,以检查芯片功能并识别有缺陷的芯片。为了防止损坏下面的结构,需要定义一个机械载荷极限。这是通过故意对衬垫施加过大压力并寻找出现的裂缝来实现的。目前,采用专利传感器压头(SI)系统的定制测试台,利用产生的声发射(ae)进行接触循环并实时识别裂纹形成。与以往的光学检测方法相比,该方法速度更快,精度更高。本文提出了一个改进版本的SI系统可用于晶圆探头,具有双梁悬臂梁与可交换压头尖端。这使得测量条件更接近生产晶圆测试,实现更准确的负载限制定义。悬臂梁包含一个用于接触力测量的应变计惠斯通桥和一个用于声发射信号检测的压电传感器元件。为两种传感器设计了放大电路,并开发了数据采集系统。给出了传感器悬臂组合(SCC)的原型,并给出了仿真和实验结果。力传感器的精度($\pm 0.5~{\rightarrow}~\pm 1.3$ mN)和声发射信号的信噪比($29.1~{\rightarrow}~21$ dB)与以前的SI系统相比仅略有下降。测试样本的裂纹概率分析证实了SCC的可用性,因为两种传感器设置在相似的机械载荷下检测到声发射裂纹信号。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
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