Impedance spectroscopy study in lead-free (0.75) Ba0.95Ca0.05Ti0.95Sn0.05O3/(0.25) Ni0.7Zn0.3Fe2O4 particulate composite

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Biman Kar, Pawan Kumar, Chandra Sekhar Mallam, Durga Prasad Sahu
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引用次数: 0

Abstract

Bi-phasic lead-free particulate composite of 75 wt.% Ba0.95Ca0.05Ti0.95Sn0.05O3—25 wt.% Ni0.7Zn0.3Fe2O4 (BTCS/NZFO) was synthesized by solid-state reaction method. The crystallographic phase formation of the composite was confirmed by the Rietveld refinement analysis of the X-ray diffraction data. Dielectric and impedance data of the composite sample were analyzed over a wide range of frequency and temperature domains. Maxwell–Wagner-type relaxation and thermally activated charge hopping were observed in the composite samples in frequency and temperature-dependent dielectric spectra. The impedance spectroscopy measurements revealed a non-Debye-like dielectric relaxation prevailing in the composite. It also confirmed the contribution of grain and grain boundary effect in the electrical properties of the composite with the absence of surface charge polarization. The frequency dependent conductivity behavior obeys Jonscher’s power law and confirms the presence of correlated barrier hopping (CBH) conduction in the composite. High dielectric constant (εr) with low loss (tan δ) makes this composite a promising candidate for capacitor and high-frequency device application.

无铅 (0.75) Ba0.95Ca0.05Ti0.95Sn0.05O3/(0.25) Ni0.7Zn0.3Fe2O4 颗粒复合材料中的阻抗光谱研究
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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