Yang Xi, Yunpeng Zhang, Zhiqaing Tian, Tianjian Liu, Can Sheng, Bo Zhao, Zhaofu Zhang, Shizhao Wang, Sheng Liu
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引用次数: 0
Abstract
With the drastic reduction of the TSV diameter leading to a critical dimension comparable to the Cu-filled grain size, the grain condition strongly influences the thermo-mechanical behavior of the TSV. In this work, the TSV-Cu cross-section with different grain sizes is characterized by EBSD, confirming that the sidewall grain size (0.638-1.580 μm) is smaller compared to other regions (1.022-2.134 μm). A finite element model (FEM) considering copper grains is constructed by using Voronoi diagrams to investigate the effect of sidewall grain size as well as area on the thermo-mechanical behavior during annealing. The material parameters in the FEM are optimized through nanoindentation inversion and considering the mechanical property anisotropy of copper grains. The yield strength σy and hardening exponent n of TSV-Cu are 74.6 MPa and 0.514. The simulation results indicate that the protrusion of TSV-Cu after annealing tends to increase initially and then decrease with smaller sidewall grain size and area. The maximum increase in protrusion caused by the two variables can reach 6.74% and 14.6%, respectively, relative to the average grain condition. Additionally, the simulation results were validated by quantifying grain boundaries in TSV-Cu samples with varying grain sizes.
期刊介绍:
Microsystems & Nanoengineering is a comprehensive online journal that focuses on the field of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). It provides a platform for researchers to share their original research findings and review articles in this area. The journal covers a wide range of topics, from fundamental research to practical applications. Published by Springer Nature, in collaboration with the Aerospace Information Research Institute, Chinese Academy of Sciences, and with the support of the State Key Laboratory of Transducer Technology, it is an esteemed publication in the field. As an open access journal, it offers free access to its content, allowing readers from around the world to benefit from the latest developments in MEMS and NEMS.