Passive Intermodulation Model Based on Conductors Cross-Section for Printed Transmission Line

IF 2 3区计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-16 DOI:10.1109/TEMC.2024.3511254

Mingtai Li;Tuanjie Li

{"title":"Passive Intermodulation Model Based on Conductors Cross-Section for Printed Transmission Line","authors":"Mingtai Li;Tuanjie Li","doi":"10.1109/TEMC.2024.3511254","DOIUrl":null,"url":null,"abstract":"When the cross section of a transmission line (TL) with a complex shape affects the internal electromagnetic field distribution of the conductor, it is necessary to combine the numerical method and the cross-sectional shape of the conductor to calculate the electrothermal passive intermodulation (ET PIM) current density caused by the uneven current distribution. Therefore, to analyze the influence of TL cross-sectional geometry on ET PIM, an ET PIM model of TL considering conductor cross-sectional geometry and transmission loss is derived. In the model, the modified gradient model is defined to characterize the nonlinear conductivity and conductor loss. Meanwhile, the PIM measurement experiments of the microstrip line, meshed microstrip line and parallel plate waveguide are designed to compare numerical solutions of the ET PIM3 model. Finally, numerical analyses of cross-sectional geometry effects on ET PIM3 generation are made to explain the phenomenon of ET PIM3 measurement. Combined with the measurement results, the numerical solution shows that the ET PIM produced in the high current density region is affected by the cross-sectional geometry, frequency offset, and thermal flux.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 2","pages":"634-643"},"PeriodicalIF":2.0000,"publicationDate":"2024-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10804061/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

When the cross section of a transmission line (TL) with a complex shape affects the internal electromagnetic field distribution of the conductor, it is necessary to combine the numerical method and the cross-sectional shape of the conductor to calculate the electrothermal passive intermodulation (ET PIM) current density caused by the uneven current distribution. Therefore, to analyze the influence of TL cross-sectional geometry on ET PIM, an ET PIM model of TL considering conductor cross-sectional geometry and transmission loss is derived. In the model, the modified gradient model is defined to characterize the nonlinear conductivity and conductor loss. Meanwhile, the PIM measurement experiments of the microstrip line, meshed microstrip line and parallel plate waveguide are designed to compare numerical solutions of the ET PIM3 model. Finally, numerical analyses of cross-sectional geometry effects on ET PIM3 generation are made to explain the phenomenon of ET PIM3 measurement. Combined with the measurement results, the numerical solution shows that the ET PIM produced in the high current density region is affected by the cross-sectional geometry, frequency offset, and thermal flux.

查看原文本刊更多论文

基于印刷传输线导体截面的无源互调模型

当形状复杂的传输线截面影响导体内部电磁场分布时，有必要将数值方法与导体截面形状相结合，计算由电流分布不均匀引起的电热无源互调（ET PIM）电流密度。因此，为了分析TL截面几何形状对ET PIM的影响，推导了考虑导体截面几何形状和传输损耗的TL ET PIM模型。在模型中，定义了修正梯度模型来表征非线性电导率和导体损耗。同时，设计了微带线、网状微带线和平行板波导的PIM测量实验，比较了ET PIM3模型的数值解。最后，对横截面几何效应对ET PIM3产生的影响进行了数值分析，以解释ET PIM3测量的现象。结合实测结果，数值解表明，在高电流密度区域产生的ET PIM受截面几何形状、频率偏移和热通量的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

IEEE Transactions on Electromagnetic Compatibility 工程技术-电信学

CiteScore

4.80

自引率

19.00%

发文量

235

审稿时长

2.3 months

期刊介绍： IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.