Environmental Life-Cycle Assessment (LCA) of Wireless RF Systems: A Comparative Sustainability Analysis and a Microwave Engineers' Guide to LCA

IF 6.9 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Mahmoud Wagih;Andrew Bainbridge;Bashayer Alsulami;Jeff Kettle
{"title":"Environmental Life-Cycle Assessment (LCA) of Wireless RF Systems: A Comparative Sustainability Analysis and a Microwave Engineers' Guide to LCA","authors":"Mahmoud Wagih;Andrew Bainbridge;Bashayer Alsulami;Jeff Kettle","doi":"10.1109/JMW.2024.3455575","DOIUrl":null,"url":null,"abstract":"Information Communication and Technology (ICT) accounts for an increasing share of global Green House Gas (GHG) emissions. Wireless circuits and systems are indispensable in across all ICT sectors, from cellular networks through satellite communications, to the Internet of Things (IoT). While Life Cycle Assessment (LCA) is an industry-standard methodology for assessing the environmental impact of systems, there has been no comprehensive LCA study focusing on RF systems. We present the first comparative LCA specific to RF and microwave applications, and a design-for-sustainability guide covering mainstream RF applications. With Integrated Circuits (ICs) having the largest environmental impact, the trends in RFICs and MMICs are summarized and evaluated from an environmental perspective. Moving to mmWave frequencies, beyond 20 GHz, results in a shift to over 50% smaller node size above 28 GHz, but with minimal reduction in the core chip area, which inevitably increases the environmental footprint of 5G/6G mmWave systems. We then review active and passive microwave circuits focusing on phased array elements and filters, both distributed and lumped. A bespoke model for RF PCBs is also presented to model the surface finish and transmission line or antenna area accurately. Our LCA indicates that design choices such as the CMOS process, PCB material and surface finish, can have a large environmental impact at the manufacturing stage. We highlight the importance of low-loss components, comparing microstrip and LC filters, where a higher end-to-end RF system efficiency directly translates to a lower global warming potential (GWP), reducing Scope 2 GHG emissions.","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"4 4","pages":"987-1000"},"PeriodicalIF":6.9000,"publicationDate":"2024-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10703165","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE journal of microwaves","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10703165/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Information Communication and Technology (ICT) accounts for an increasing share of global Green House Gas (GHG) emissions. Wireless circuits and systems are indispensable in across all ICT sectors, from cellular networks through satellite communications, to the Internet of Things (IoT). While Life Cycle Assessment (LCA) is an industry-standard methodology for assessing the environmental impact of systems, there has been no comprehensive LCA study focusing on RF systems. We present the first comparative LCA specific to RF and microwave applications, and a design-for-sustainability guide covering mainstream RF applications. With Integrated Circuits (ICs) having the largest environmental impact, the trends in RFICs and MMICs are summarized and evaluated from an environmental perspective. Moving to mmWave frequencies, beyond 20 GHz, results in a shift to over 50% smaller node size above 28 GHz, but with minimal reduction in the core chip area, which inevitably increases the environmental footprint of 5G/6G mmWave systems. We then review active and passive microwave circuits focusing on phased array elements and filters, both distributed and lumped. A bespoke model for RF PCBs is also presented to model the surface finish and transmission line or antenna area accurately. Our LCA indicates that design choices such as the CMOS process, PCB material and surface finish, can have a large environmental impact at the manufacturing stage. We highlight the importance of low-loss components, comparing microstrip and LC filters, where a higher end-to-end RF system efficiency directly translates to a lower global warming potential (GWP), reducing Scope 2 GHG emissions.
无线射频系统的环境生命周期评估(LCA):可持续性比较分析》和《微波工程师生命周期评估指南
信息通信和技术(ICT)在全球温室气体(GHG)排放中所占的份额越来越大。从蜂窝网络到卫星通信,再到物联网(IoT),无线电路和系统在所有ICT部门都是不可或缺的。虽然生命周期评估(LCA)是评估系统环境影响的行业标准方法,但目前还没有针对射频系统的全面LCA研究。我们提出了第一个针对射频和微波应用的LCA比较,以及涵盖主流射频应用的可持续性设计指南。由于集成电路(ic)对环境的影响最大,本文从环境的角度总结和评估了rfic和mmic的发展趋势。迁移到20ghz以上的毫米波频率,导致28ghz以上的节点尺寸减少50%以上,但核心芯片面积减少最少,这不可避免地增加了5G/6G毫米波系统的环境足迹。然后,我们回顾了有源和无源微波电路,重点是相控阵元件和滤波器,包括分布式和集总。还提出了射频pcb的定制模型,以准确地模拟表面光洁度和传输线或天线面积。我们的LCA表明,设计选择,如CMOS工艺,PCB材料和表面光洁度,在制造阶段会对环境产生很大影响。我们强调了低损耗元件的重要性,比较了微带滤波器和LC滤波器,其中更高的端到端射频系统效率直接转化为更低的全球变暖潜势(GWP),减少了范围2的温室气体排放。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
10.70
自引率
0.00%
发文量
0
审稿时长
8 weeks
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信