A 3 nm-FinFET 4.3 GHz 21.1 Mb/mm2 Double-Pumping 1-Read and 1-Write Psuedo-2-Port SRAM With a Folded Bitline Multi-Bank Architecture

IF 4.6 1区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Masaru Haraguchi;Yorinobu Fujino;Yoshisato Yokoyama;Ming-Hung Chang;Yu-Hao Hsu;Hong-Chen Cheng;Koji Nii;Yih Wang;Tsung-Yung Jonathan Chang
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引用次数: 0

Abstract

A double-pumped 1-read and 1-write pseudo-2-port 6T static random access memory (SRAM) with folded bitline (BL) multi-bank (MB) architecture is demonstrated on 3 nm FinFET technology. A new self-timed clock generator is proposed to optimize wordline (WL) negating with shortcut path circuit (WLNS). sense-amplifier-enable interlocking (SAEI) circuit and the clock generator can provide a 3.6% increase in the maximum operating frequency ( $f_{\text {MAX}}$ ) by minimizing the tail period of the read operation. The data pre-loading write driver (PLWD) circuit facilitates a shorter separation time between read and write operations by overlapping BL pre-charge and write data loading on the BL, thereby leading to a 4.4% improvement in $f_{\text {MAX}}$ . The WLNS and PLWD contribute to 2.4% $f_{\text {MAX}}$ gain by promoting contention-free features between the BL pre-charge and write driver circuits. Furthermore, the real-time dynamic performance scaling (RTDPS) feature ensures a robust SRAM read/write operation across the entire supply voltage range by optimizing WL pulsewidth. The test chip measurement results show that it achieves a 5.9% increase in $f_{\text {MAX}}$ at high voltage ranges. In addition, the memory density is 21.1 Mb/mm2, and $f_{\text {MAX}}$ is 4.3 GHz, resulting in a figure of merit (FoM) of 90.7 GHz $\times $ Mb/mm2/V.
一种3nm - finfet 4.3 GHz 21.1 Mb/mm双泵浦1读1写伪2端口SRAM,具有折叠位线多银行架构
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来源期刊
IEEE Journal of Solid-state Circuits
IEEE Journal of Solid-state Circuits 工程技术-工程:电子与电气
CiteScore
11.00
自引率
20.40%
发文量
351
审稿时长
3-6 weeks
期刊介绍: The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.
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