Challenges and progress in packaging materials for power modules with high operation temperature: Review

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Shilin Zhao, Yan Tong, Chunbiao Wang, Erxian Yao
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引用次数: 0

Abstract

Power semiconductor modules are increasingly applied in the electrical power conversion system, whose development has been characterized by increasing power density and higher operation (or junction) temperature. However, this development presents additional challenges for the packaging assembly of power modules, especially for the packaging materials since they are inevitably subjected to severe thermal loads. To design and manufacture high operation temperature power modules with excellent performance and reliability, a deep understanding of the effects of high temperature on the microstructure and properties of packaging materials and an awareness of the progress of novel packaging materials suitable for high-temperature conditions are necessary, which however, are still lack of systematic review. In this work, the critical packaging materials for power modules, i.e., bonding wire, on-chip metallization layer, and solder alloys have been discussed with respect to the thermal-related failure modes and the corresponding failure mechanisms analyzed based on microstructure degradation and thermal–mechanical effects. The effects of increasing temperature on the reliability of packaging materials are also introduced. Moreover, solutions for improving the thermal performances of materials, the available optimized heat-resisting materials, and the development direction of packaging materials has been concluded and evaluated.

Abstract Image

高温电源模块封装材料的挑战与进展:综述
功率半导体模块在电力转换系统中的应用越来越广泛,其发展的特点是功率密度越来越高,工作(或结)温度越来越高。然而,这一发展为电源模块的封装组装带来了额外的挑战,特别是对于封装材料,因为它们不可避免地要承受严重的热负荷。为了设计和制造具有优异性能和可靠性的高温电源模块,必须深入了解高温对封装材料微观结构和性能的影响,并了解适用于高温条件的新型封装材料的进展,但目前还缺乏系统的综述。本文讨论了功率模块的关键封装材料,即键合线、片上金属化层和焊料合金的热相关失效模式,并基于微观结构退化和热力学效应分析了相应的失效机制。还介绍了温度升高对包装材料可靠性的影响。总结并评价了提高材料热性能的解决方案、现有的优化耐热材料以及包装材料的发展方向。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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