Research progress on the magnetoelectric coupling effect of core–shell structured composite multiferroic materials: review

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Haowen Mu, Shiqi Chen, Chen Chen, Huan Li, Rongli Gao, Xiaoling Deng, Wei Cai, Chunlin Fu
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引用次数: 0

Abstract

Multiferroic composites with core–shell structured are materials that exhibit both ferromagnetic and ferroelectric properties, have gained great attentions due to its effectively enhanced interfacial contact and stress transfer. By selecting material types, tailoring the interconnection forms of the two phases, and employing microstructural tuning, further enhancement of magnetoelectric coupling (ME) effect can be achieved. Therefore, core–shell structured multiferroic composites hold significant application potential in non-volatile memory, sensors, and imaging diagnostics. This paper presents a review of the current state of research on multiferroic composites for nuclear shell structures based on the connection form of the material, focusing mainly on the 0–0, 0–3, 1–1, and 1–3 types of nuclear shell structures. Additionally, it analyzes the main influences of various factors (such as material types and compositions, dimensions, and morphologies) on ME effect under different connection forms. This provides a foundation for the subsequent regulation of the ME effect of core–shell structured multiferroic composites. Finally, the review summarizes the relevant applications of these materials in the fields of electronics and healthcare.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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