Microstructure, IMCs layer and shear property of Sn-9Zn solder joints reinforced by Cu nanoparticles during thermal cycling

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2024-12-09 DOI:10.1007/s10854-024-13958-7

Haodong Wu, Haoran Lai, Li Yang, Xiangyu Wang, Zhitao Zhang

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引用次数: 0

Abstract

The microstructure, interfacial intermetallic compounds (IMCs) and shear property of Sn-9Zn and Sn-9Zn-30Cu composite solder joints during thermal cycling were studied (Cu is the nanoparticles). The results showed that Sn-rich and Zn-rich phases exist widely in the in-situ reaction zone of the Cu/Sn-9Zn/Cu solder joints. At the later stage of the thermal cycle (800–1000 thermal cycles), Cu₆(Sn,Zn)₅ was found and the Zn-rich phase disappeared. Cu₆(Sn,Zn)₅ and Cu₃Sn phases in the in-situ reaction zone of the Cu/Sn-9Zn-30Cu/Cu solder joint remained stable during thermal cycling. The thickness of the interfacial IMCs layer of the Cu/Sn-9Zn/Cu and the Cu/Sn-9Zn-30Cu/Cu solder joints is 5.51 μm and 5.30 μm, and it is increased to 9.66 μm and 5.89 μm after 1000 thermal cycles, respectively. The shear strength of the Cu/Sn-9Zn/Cu solder joints dropped from 14.18 MPa to 5.89 MPa after 1000 thermal cycles, while the shear strength of the Cu/Sn-9Zn-30Cu/Cu solder joints decreased from 17.24 MPa to 9.47 MPa. The fracture position of the Cu/Sn-9Zn/Cu solder joints changes from the interfacial reaction zone to the in-situ reaction zone with increasing thermal cycling times. The fracture of the Cu/Sn-9Zn-30Cu/Cu solder joints always occurs in the in-situ reaction zone.

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.