Investigations on flexible dielectric material-based wearable antenna for tumor detection

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
T. A. Karthikeyan, M. Nesasudha, M. L. Valarmathi
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引用次数: 0

Abstract

In this paper, the design and comparative evaluation of five distinct substrate materials with variable relative permittivity values (2.71, 1.65, 1.51, 1.36, and 1.05), namely Polydimethylsiloxane (PDMS), Jean, Cotton, Felt, and Foam. The performance of the microstrip patch antenna is largely dependent on the dielectric materials used as the substrate and the patch shapes. Two approaches are used to carry out the analysis: in the first, five substrates with identical dimensions are used on the antenna and different frequencies are obtained. It is observed that when the dielectric constant decreases the frequency of the antenna shift towards right side. In the second method, to obtain the same frequency (2.45 GHz ISM band) five substrates with different dimensions are used on the antenna. Though the dimensions of the antenna varies but the number of Faces, Edges, and Vertices are same. The proposed antenna design is simulated in HFSS and Fabricated using synthesized PDMS substrate. The field overlays difference between the healthy and tumor affected phantom depicts the presence of tumor.

基于柔性介质材料的可穿戴肿瘤检测天线研究
本文设计了五种相对介电常数(2.71、1.65、1.51、1.36和1.05)不同的衬底材料,即聚二甲基硅氧烷(PDMS)、牛仔布、棉花、毛毡和泡沫。微带贴片天线的性能在很大程度上取决于用作衬底的介电材料和贴片的形状。采用两种方法进行分析:第一种方法是在天线上使用5个尺寸相同的基片,得到不同的频率。观察到,当介电常数减小时,天线的频率向右偏移。在第二种方法中,为了获得相同的频率(2.45 GHz ISM频段),在天线上使用了5个不同尺寸的基片。虽然天线的尺寸不同,但面、边和顶点的数量是相同的。所提出的天线设计在HFSS中进行了仿真,并在合成的PDMS基板上进行了制作。视场覆盖在健康幻像和肿瘤幻像之间的差异描述了肿瘤的存在。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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