Jiamei Luo , Xueqin Yang , Yi Xue , Chenxi Yang , Yong Liu , Yu Ma , Minqiang Jiang , Hui Zhang , Jianyong Yu
{"title":"Aramid nanofiber supported spherical Al2O3/BN film with high thermal conductivity and outstanding dimensional stability","authors":"Jiamei Luo , Xueqin Yang , Yi Xue , Chenxi Yang , Yong Liu , Yu Ma , Minqiang Jiang , Hui Zhang , Jianyong Yu","doi":"10.1016/j.apsusc.2024.161999","DOIUrl":null,"url":null,"abstract":"<div><div>Polymeric thermal management materials present several advantages that cannot be substituted by metallic or ceramic materials, including easy processing, lightweight characteristics, and low density. However, the unsatisfactory thermal conductivity of polymers limits their effectiveness in dissipating heat during the operation of electrical appliances. This study focuses on the preparation of polymer nanofiber films that exhibit high thermal conductivity and thermal stability through the engineering of flexible aramid nanofibers (ANFs) characterized by a one-dimensional linear structure in conjunction with spherical Al<sub>2</sub>O<sub>3</sub>/BN particles that possess a rigid structure. The introduction of rigid Al<sub>2</sub>O<sub>3</sub>/BN particles mitigated the internal agglomeration and entanglement of ANFs, thereby promoting a more organized arrangement of the polymer molecular chains, which resulted in a 54.87 % enhancement in the in-plane thermal conductivity. Furthermore, the favorable interfacial interactions between the stacked ANFs and the Al<sub>2</sub>O<sub>3</sub>/BNs further promoted efficient phonon transfer. Additionally, the superior thermal and dimensional stability of the polymer nanofiber films enables effective thermal management of electronic devices operating within a temperature range of 20–120 °C.</div></div>","PeriodicalId":247,"journal":{"name":"Applied Surface Science","volume":"685 ","pages":"Article 161999"},"PeriodicalIF":6.9000,"publicationDate":"2024-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Surface Science","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0169433224027156","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Polymeric thermal management materials present several advantages that cannot be substituted by metallic or ceramic materials, including easy processing, lightweight characteristics, and low density. However, the unsatisfactory thermal conductivity of polymers limits their effectiveness in dissipating heat during the operation of electrical appliances. This study focuses on the preparation of polymer nanofiber films that exhibit high thermal conductivity and thermal stability through the engineering of flexible aramid nanofibers (ANFs) characterized by a one-dimensional linear structure in conjunction with spherical Al2O3/BN particles that possess a rigid structure. The introduction of rigid Al2O3/BN particles mitigated the internal agglomeration and entanglement of ANFs, thereby promoting a more organized arrangement of the polymer molecular chains, which resulted in a 54.87 % enhancement in the in-plane thermal conductivity. Furthermore, the favorable interfacial interactions between the stacked ANFs and the Al2O3/BNs further promoted efficient phonon transfer. Additionally, the superior thermal and dimensional stability of the polymer nanofiber films enables effective thermal management of electronic devices operating within a temperature range of 20–120 °C.
期刊介绍:
Applied Surface Science covers topics contributing to a better understanding of surfaces, interfaces, nanostructures and their applications. The journal is concerned with scientific research on the atomic and molecular level of material properties determined with specific surface analytical techniques and/or computational methods, as well as the processing of such structures.