Relaxation Dynamics of Sputtered Fe80Co20 Thin Films on Different Substrates: Micromagnetic Validation

IF 1.1 4区 物理与天体物理 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Mohammad Asif;Prashant Kumar;Mirza Tariq Beg;M. Nizamuddin;Bijoy Kumar Kuanr
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引用次数: 0

Abstract

In the present investigation, we have demonstrated the effect of different substrates (Si, SiO 2 ${\rm{, }}\;\text{and}\;\text {{A}}{{{\text {l}}}_{2}}{{{\text {O}}}_{3}}$ ) and deposition temperatures ( TD = 27 °C to 450 °C) of sputtered Fe 80 Co 20 ferromagnetic thin films of 30 nm thickness on their microstructural, static, and dynamic properties. The lowest value of Gilbert damping (α eff ) of 5.1 $ \times\, 10$ −3 with a high saturation magnetization ( MS ) is the outcome of the improved atomic ordering and overall film crystallinity with ultralow interfacial roughness (0.23 ± 0.03 nm) of 400 °C grown films. The structural analysis from atomic force microscopy depicts temperature-dependent improvement in films grown at 400 °C. From ferromagnetic resonance and vibrating sample magnetometry experiments, magnetization was determined to be the highest MS $ \approx \text {1628.8}\ {\rm{emu/cc}}$ for the films grown at 400 °C. We have validated the above-mentioned experimental data through micromagnetic simulation using ubermag and an object-oriented micromagnetic framework that is used in backend for computation.
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来源期刊
IEEE Magnetics Letters
IEEE Magnetics Letters PHYSICS, APPLIED-
CiteScore
2.40
自引率
0.00%
发文量
37
期刊介绍: IEEE Magnetics Letters is a peer-reviewed, archival journal covering the physics and engineering of magnetism, magnetic materials, applied magnetics, design and application of magnetic devices, bio-magnetics, magneto-electronics, and spin electronics. IEEE Magnetics Letters publishes short, scholarly articles of substantial current interest. IEEE Magnetics Letters is a hybrid Open Access (OA) journal. For a fee, authors have the option making their articles freely available to all, including non-subscribers. OA articles are identified as Open Access.
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