{"title":"Understanding the electric field dependent channel migration for shorter channel length of multilayer rhenium disulfide (ReS<sub>2</sub>) FETs.","authors":"Hyeong Jin Choi, Yun Jae Choi, Gyu-Tae Kim","doi":"10.1088/1361-6528/ad992f","DOIUrl":null,"url":null,"abstract":"<p><p>Multilayer rhenium disulfide (ReS<sub>2</sub>) has attracted considerable attention due to the decoupled van der Waals interaction between its adjacent layers, leading to significantly higher interlayer resistance compared with other layered materials. While the carrier transport in multilayer materials can be well described by the interlayer resistance (<i>R</i><sub>Int</sub>) and Thomas-Fermi charge screening length (λTF) in resistor network models, the electric field scaling of the channel with the back gate voltage (<i>V</i><sub>BG</sub>) and the drain voltage (<i>V</i><sub>D</sub>) is limited in two-dimensional (2D) multilayer materials. In this report, we present the effects of<i>V</i><sub>BG</sub>and<i>V</i><sub>D</sub>on the channel migration of ReS<sub>2</sub>field effect transistors (FETs) with channel lengths of 0.25, 2.4, and 4.4<i>μ</i>m. For shorter channels, the<i>V</i><sub>BG</sub>-dependent conductance (<i>G</i>= (drain current (<i>I</i><sub>D</sub>)/<i>V</i><sub>D</sub>)) increases with increasing<i>V</i><sub>D</sub>, different from the longer channels. Based on the resistor network model, the different behaviors with channel lengths were analyzed by considering the interlayer resistance (<i>R</i><sub>Int</sub>) versus the channel resistance and the Thomas-Fermi charge screening length (λTF). Lower back gate voltage (<i>V</i><sub>BG</sub>) in shorter channels builds the channel near the bottom layer close to the oxide, while high<i>V</i><sub>BG</sub>shifts the conductive channel to the top sheet exposed to ambient condition. In longer channels, due to the increased channel resistance (<i>R</i><sub>ch</sub>), the conductive channel forms near the bottom side close to the oxide. The increase of the threshold voltage (<i>V</i><sub>th</sub>) was observed at higher drain-source voltages (<i>V</i><sub>D</sub>), but in opposite for the top side channel, i.e. the decrease of threshold voltage with increasing<i>V</i><sub>D</sub>. This study will give a hint on establishing the electric field scaling of 2D material-based FETs with channel lengths and applied voltages of<i>V</i><sub>BG</sub>and<i>V</i><sub>D</sub>.</p>","PeriodicalId":19035,"journal":{"name":"Nanotechnology","volume":" ","pages":""},"PeriodicalIF":2.9000,"publicationDate":"2024-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nanotechnology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1088/1361-6528/ad992f","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Multilayer rhenium disulfide (ReS2) has attracted considerable attention due to the decoupled van der Waals interaction between its adjacent layers, leading to significantly higher interlayer resistance compared with other layered materials. While the carrier transport in multilayer materials can be well described by the interlayer resistance (RInt) and Thomas-Fermi charge screening length (λTF) in resistor network models, the electric field scaling of the channel with the back gate voltage (VBG) and the drain voltage (VD) is limited in two-dimensional (2D) multilayer materials. In this report, we present the effects ofVBGandVDon the channel migration of ReS2field effect transistors (FETs) with channel lengths of 0.25, 2.4, and 4.4μm. For shorter channels, theVBG-dependent conductance (G= (drain current (ID)/VD)) increases with increasingVD, different from the longer channels. Based on the resistor network model, the different behaviors with channel lengths were analyzed by considering the interlayer resistance (RInt) versus the channel resistance and the Thomas-Fermi charge screening length (λTF). Lower back gate voltage (VBG) in shorter channels builds the channel near the bottom layer close to the oxide, while highVBGshifts the conductive channel to the top sheet exposed to ambient condition. In longer channels, due to the increased channel resistance (Rch), the conductive channel forms near the bottom side close to the oxide. The increase of the threshold voltage (Vth) was observed at higher drain-source voltages (VD), but in opposite for the top side channel, i.e. the decrease of threshold voltage with increasingVD. This study will give a hint on establishing the electric field scaling of 2D material-based FETs with channel lengths and applied voltages ofVBGandVD.
期刊介绍:
The journal aims to publish papers at the forefront of nanoscale science and technology and especially those of an interdisciplinary nature. Here, nanotechnology is taken to include the ability to individually address, control, and modify structures, materials and devices with nanometre precision, and the synthesis of such structures into systems of micro- and macroscopic dimensions such as MEMS based devices. It encompasses the understanding of the fundamental physics, chemistry, biology and technology of nanometre-scale objects and how such objects can be used in the areas of computation, sensors, nanostructured materials and nano-biotechnology.