Hollow glass microsphere/polybutadiene composites with low dielectric constant and ultralow dielectric loss in high-frequency

IF 2.7 3区 化学 Q2 POLYMER SCIENCE
Ting Ren, Ruikun Wang, Yang Zhang, Shengqiang Nie, Shaoyun Guo, Xianlong Zhang
{"title":"Hollow glass microsphere/polybutadiene composites with low dielectric constant and ultralow dielectric loss in high-frequency","authors":"Ting Ren,&nbsp;Ruikun Wang,&nbsp;Yang Zhang,&nbsp;Shengqiang Nie,&nbsp;Shaoyun Guo,&nbsp;Xianlong Zhang","doi":"10.1002/app.56351","DOIUrl":null,"url":null,"abstract":"<p>High-frequency dielectric materials have been widely and rapidly applied in areas such as automotive radar, Internet of Things, artificial intelligence, and quantum computing. Currently, the challenge in high-frequency dielectric materials lies in reducing the dielectric constant (<i>D</i><sub><i>k</i></sub>) and dielectric loss (<i>D</i><sub><i>f</i></sub>) without sacrificing its mechanical properties. This study addresses this challenge by introducing air, as the most common “low dielectric factor,” into the polymer matrix in the form of hollow glass microspheres. Meanwhile, the reactive vinyl groups were also introduced onto the surface of the hollow glass microspheres, enabling an interfacial chemical reaction between the side vinyl groups of polybutadiene and its surface so that the organic–inorganic interface compatibility and interface peel strength are simultaneously improved. Consequently, the minimum <i>D</i><sub><i>k</i></sub> of 1.29 and <i>D</i><sub><i>f</i></sub> of 0.0012 in 3–18 GHz are achieved, and the interface peel strength also reaches 0.65 N/mm. Molecular dynamics simulations, analysis of dielectric properties, and interface peel strength reveal the influence of hollow glass microspheres' morphology and chemical structure on their high-frequency dielectric performance and adhesive strength. This paper provides effective strategies for the structural design and preparation of high-frequency, low-dielectric composites, contributing to the further development of next-generation microwave communication devices towards higher frequencies and faster information transmission.</p>","PeriodicalId":183,"journal":{"name":"Journal of Applied Polymer Science","volume":"142 2","pages":""},"PeriodicalIF":2.7000,"publicationDate":"2024-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Applied Polymer Science","FirstCategoryId":"92","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/app.56351","RegionNum":3,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0

Abstract

High-frequency dielectric materials have been widely and rapidly applied in areas such as automotive radar, Internet of Things, artificial intelligence, and quantum computing. Currently, the challenge in high-frequency dielectric materials lies in reducing the dielectric constant (Dk) and dielectric loss (Df) without sacrificing its mechanical properties. This study addresses this challenge by introducing air, as the most common “low dielectric factor,” into the polymer matrix in the form of hollow glass microspheres. Meanwhile, the reactive vinyl groups were also introduced onto the surface of the hollow glass microspheres, enabling an interfacial chemical reaction between the side vinyl groups of polybutadiene and its surface so that the organic–inorganic interface compatibility and interface peel strength are simultaneously improved. Consequently, the minimum Dk of 1.29 and Df of 0.0012 in 3–18 GHz are achieved, and the interface peel strength also reaches 0.65 N/mm. Molecular dynamics simulations, analysis of dielectric properties, and interface peel strength reveal the influence of hollow glass microspheres' morphology and chemical structure on their high-frequency dielectric performance and adhesive strength. This paper provides effective strategies for the structural design and preparation of high-frequency, low-dielectric composites, contributing to the further development of next-generation microwave communication devices towards higher frequencies and faster information transmission.

中空玻璃微球/聚丁二烯复合材料具有低介电常数和超低高频介质损耗
高频介电材料在汽车雷达、物联网、人工智能、量子计算等领域得到了广泛而迅速的应用。目前,高频介质材料面临的挑战在于如何在不牺牲其力学性能的前提下降低介电常数(Dk)和介电损耗(Df)。本研究通过将空气作为最常见的“低介电因子”以中空玻璃微球的形式引入聚合物基体来解决这一挑战。同时,将反应性乙烯基引入中空玻璃微球表面,使聚丁二烯侧乙烯基与其表面发生界面化学反应,从而提高了有机-无机界面相容性和界面剥离强度。因此,在3-18 GHz范围内,Dk最小为1.29,Df最小为0.0012,界面剥离强度达到0.65 N/mm。分子动力学模拟、介电性能和界面剥离强度分析揭示了中空玻璃微球的形态和化学结构对其高频介电性能和粘附强度的影响。本文为高频低介电复合材料的结构设计和制备提供了有效的策略,有助于下一代微波通信器件朝着更高频率和更快信息传输的方向进一步发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Journal of Applied Polymer Science
Journal of Applied Polymer Science 化学-高分子科学
CiteScore
5.70
自引率
10.00%
发文量
1280
审稿时长
2.7 months
期刊介绍: The Journal of Applied Polymer Science is the largest peer-reviewed publication in polymers, #3 by total citations, and features results with real-world impact on membranes, polysaccharides, and much more.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信