EIT-MP: A 2-D Electrical Impedance Tomography Image Reconstruction Method Based on Mixed Precision Asymmetrical Neural Network for Hardware–Software Co-Optimization Platform

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Jiajie Huang;Qianyu Guo;Yunxiang Zhang;Wangzilu Lu;Chao Wang;Wenkai Zhang;Wentao Liu;Jian Zhao;Yongfu Li
{"title":"EIT-MP: A 2-D Electrical Impedance Tomography Image Reconstruction Method Based on Mixed Precision Asymmetrical Neural Network for Hardware–Software Co-Optimization Platform","authors":"Jiajie Huang;Qianyu Guo;Yunxiang Zhang;Wangzilu Lu;Chao Wang;Wenkai Zhang;Wentao Liu;Jian Zhao;Yongfu Li","doi":"10.1109/JSEN.2024.3476189","DOIUrl":null,"url":null,"abstract":"The purpose of this article is to present two technical contributions geared toward the development of 2-D electrical impedance tomography (EIT) image reconstruction based on deep learning (DL) models, which aim to provide wearable EIT applications with the best balance between accuracy, memory consumption, and latency. First, an EIT-SYN dataset enumeration algorithm is proposed in order to address the scarcity of massive labeled datasets for training DL models. The circular contour dataset is used for training and benchmarking the DL model, and the thorax-like contour dataset is used to predict how well the model will perform in vivo. Second, a mixed precision asymmetric neural network model (EIT-MP) based on a convolutional auto-encoder (CAE) architecture is proposed, where the encoder network model is implemented on ASIC/FPGA hardware and performs data preprocessing and transfer to a computer while the decoder network model on the computer reconstructs the 2-D image. With the hardware-software co-optimization method, data can be compressed and encrypted for light and secure transmission. Experimental results demonstrate that the EIT-MP model reduces memory consumption by over \n<inline-formula> <tex-math>$10.3\\times $ </tex-math></inline-formula>\n and achieves the best relative size coverage ratio (RCR) of 1.07 while maintaining a high image correlation coefficient (ICC) of 0.9220 and a short latency of 20.314 ms among state-of-the-art works. Therefore, our approach offers an appealing solution for image reconstruction in wearable EIT systems.","PeriodicalId":447,"journal":{"name":"IEEE Sensors Journal","volume":"24 23","pages":"39947-39957"},"PeriodicalIF":4.3000,"publicationDate":"2024-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Sensors Journal","FirstCategoryId":"103","ListUrlMain":"https://ieeexplore.ieee.org/document/10716435/","RegionNum":2,"RegionCategory":"综合性期刊","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

The purpose of this article is to present two technical contributions geared toward the development of 2-D electrical impedance tomography (EIT) image reconstruction based on deep learning (DL) models, which aim to provide wearable EIT applications with the best balance between accuracy, memory consumption, and latency. First, an EIT-SYN dataset enumeration algorithm is proposed in order to address the scarcity of massive labeled datasets for training DL models. The circular contour dataset is used for training and benchmarking the DL model, and the thorax-like contour dataset is used to predict how well the model will perform in vivo. Second, a mixed precision asymmetric neural network model (EIT-MP) based on a convolutional auto-encoder (CAE) architecture is proposed, where the encoder network model is implemented on ASIC/FPGA hardware and performs data preprocessing and transfer to a computer while the decoder network model on the computer reconstructs the 2-D image. With the hardware-software co-optimization method, data can be compressed and encrypted for light and secure transmission. Experimental results demonstrate that the EIT-MP model reduces memory consumption by over $10.3\times $ and achieves the best relative size coverage ratio (RCR) of 1.07 while maintaining a high image correlation coefficient (ICC) of 0.9220 and a short latency of 20.314 ms among state-of-the-art works. Therefore, our approach offers an appealing solution for image reconstruction in wearable EIT systems.
基于混合精度非对称神经网络的二维电阻抗层析成像图像重构方法
本文的目的是介绍基于深度学习(DL)模型的二维电阻抗断层扫描(EIT)图像重建的两项技术贡献,旨在为可穿戴式EIT应用提供准确性、内存消耗和延迟之间的最佳平衡。首先,提出了一种EIT-SYN数据集枚举算法,以解决训练深度学习模型的大量标记数据集的稀缺性问题。圆形轮廓数据集用于DL模型的训练和基准测试,胸腔样轮廓数据集用于预测模型在体内的表现。其次,提出了一种基于卷积自编码器(CAE)架构的混合精度非对称神经网络模型(EIT-MP),其中编码器网络模型在ASIC/FPGA硬件上实现,并进行数据预处理和传输到计算机,而解码器网络模型在计算机上重建二维图像。采用软硬件协同优化的方法,可以对数据进行压缩和加密,实现轻传输和安全传输。实验结果表明,EIT-MP模型减少了超过10.3倍的内存消耗,达到了1.07的最佳相对大小覆盖率(RCR),同时保持了0.9220的高图像相关系数(ICC)和20.314 ms的短延迟。因此,我们的方法为可穿戴式EIT系统中的图像重建提供了一个有吸引力的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信