Vishnu Kumar;Sudhanshu Tiwari;Gayathri Pillai;Rudra Pratap;Saurabh A. Chandorkar
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引用次数: 0
Abstract
Piezoelectric microelectromechanical systems have significant market potential owing to their superior capabilities of transduction to those of standard capacitive and piezoresistive devices. However, piezoelectric films are often lossy, which reduces the Quality Factor of devices and affects their performance. It is thus important to examine all sources of energy dissipation in such devices and accurately determine them based on experimental data. Currently used methods to quantify energy dissipation from different sources and the properties of materials based on experimental data are set-up for piezoelectric devices, in which energy storage and dissipation primarily occur in the same piezoelectric material. Moreover, such methods rely on resonance-antiresonance measurements, and thus are unsuitable for thin-film-piezoelectric-on-substrate (TPoS) Micro/Nano devices that have i) a significant portion of energy stored in the substrate/device layer, ii) a low signal-to-noise ratio owing to either lossy piezoelectric films or high motional impedance, or iii) a larger feedthrough capacitance, arising primarily from collocated electrodes, in addition to the internal capacitance of the piezoelectric film. In this paper, we propose a method that overcomes these challenges based on synchronized optical and electrical measurements. We develop a comprehensive physics-based model to extract all the relevant parameters for the device, including the coefficient of piezoelectric coupling, internal and feedthrough capacitance, loss tangents (dielectric, piezoelectric, and mechanical), and the contributions of different sources to the Quality Factor of the device. We showcase the proposed method by using a PZT-based TPoS MEMS cantilever and a Piezoelectric Micromachined Ultrasonic Transducers (PMUT).[2024-0063]
期刊介绍:
The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.