Intralayer Molecular Packing Coefficient as One Packing Characteristic of Planar Layer-Stacked Crystals and Its Dominators

IF 3.2 2区 化学 Q2 CHEMISTRY, MULTIDISCIPLINARY
Shitai Guo, Weihua Zhu and Chaoyang Zhang*, 
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Abstract

Planar layer-stacking, as a special stacking mode, is attracting much attention in the fields of some molecular solid materials. In the present work, we propose a special index, the intralayer molecular packing coefficient (ILMPC), as the ratio of the sum of sectional areas of all molecules on a layer to that of the layer, to deepen the understanding of the planar layer-stacking. Besides, methods for calculating the sectional area (Sm,s) and perimeter (Cm,s) of a planar molecule along its plane are proposed to describe molecular size to account for its compact on describing ILMPC by intralayer intermolecular interactions (ΔEintralayer). Regarding 65 planar layer-stacking, it shows a certain correlation of ILMPC with ΔEintralayer/Cm,s (R2 = 0.30) or ΔEintralayer/Sm,s (R2 = 0.23) and a significantly linear one of packing coefficient with ILMPC/dinterlayer (R2 = 0.86) in which dinterlayer represents the interlayer distance. Hopefully, the ILMPC will be an effective geometric descriptor of intralayer molecular compactness and contribute to a deeper understanding of planar layer-stacking.

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来源期刊
Crystal Growth & Design
Crystal Growth & Design 化学-材料科学:综合
CiteScore
6.30
自引率
10.50%
发文量
650
审稿时长
1.9 months
期刊介绍: The aim of Crystal Growth & Design is to stimulate crossfertilization of knowledge among scientists and engineers working in the fields of crystal growth, crystal engineering, and the industrial application of crystalline materials. Crystal Growth & Design publishes theoretical and experimental studies of the physical, chemical, and biological phenomena and processes related to the design, growth, and application of crystalline materials. Synergistic approaches originating from different disciplines and technologies and integrating the fields of crystal growth, crystal engineering, intermolecular interactions, and industrial application are encouraged.
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