Research on comprehensive heat dissipation characteristics of AlSi7Mg TPMS heat sinks manufactured by laser powder bed fusion

IF 6.1 2区 工程技术 Q2 ENERGY & FUELS
Chang Liu , Mingkang Zhang , Guijun Bi , Jie Chen , Yuchao Bai , Di Wang , Mingjian Deng
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引用次数: 0

Abstract

The comprehensive heat transfer characteristics of triply periodic minimal surface heat sinks were investigated in this research, and triply periodic minimal surface structures were manufactured by laser powder bed fusion with AlSi7Mg powder. The average surface temperature, thermal resistance, heat transfer coefficient, and specific heat transfer coefficient of heat sinks were tested, and the heat dissipation mechanism was analyzed by finite element thermal flow analysis. The results of the homogeneous triply periodic minimal surface show that Primitive has the best comprehensive heat transfer performance under forced convection, and Gyroid is the best without forced convection. Compared with homogeneous and gradient triply periodic minimal surfaces, the P-Quadratic ΙΙ structure has the best comprehensive heat transfer performance under forced convection and natural thermal conductivity. Compared with homogeneous Primitive, the average convection heat transfer coefficient of P-Quadratic ΙΙ is increased by 13.44 % ∼ 19.78 %. The finite element thermal flow analysis shows that the narrow tube effect of Bernoulli’s principle and eddy current enhanced the heat transfer performance of Primitive and gradient Primitive.
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来源期刊
Applied Thermal Engineering
Applied Thermal Engineering 工程技术-工程:机械
CiteScore
11.30
自引率
15.60%
发文量
1474
审稿时长
57 days
期刊介绍: Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application. The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.
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