Quanji Wang , Shaorui Yang , Le Liu , Zijing Yang , Xinke Xu , Si Wu , Xiaohui Su , Jun Duan , Lei Liu , Wei Xiong , Leimin Deng
{"title":"Rapid fabrication of through-hole arrays in thin glass by femtosecond laser bursts assisted with chemical etching","authors":"Quanji Wang , Shaorui Yang , Le Liu , Zijing Yang , Xinke Xu , Si Wu , Xiaohui Su , Jun Duan , Lei Liu , Wei Xiong , Leimin Deng","doi":"10.1016/j.optlaseng.2024.108698","DOIUrl":null,"url":null,"abstract":"<div><div>A large-area vertical through-hole array in thin glass is rapidly fabricated by using femtosecond laser bursts assisted with chemical etching. By investigating the effects of the sub-pulse number and total pulse energy on the morphologies of the ablated microholes, as well as the effects of the chemical etching time and the concentration of HF acid solution on the morphologies of the through-holes, it is found that only under the condition that the upper surface of the glass microhole arrays is not ablated, but the exit is ablated by the femtosecond laser bursts with the increase of the sub-pulse number, a uniform and nearly vertical through-hole array can be obtained after etching in 5-wt% HF acid solution for 20 min. This single-step femtosecond laser bursts scanning method can significantly improve the fabrication efficiency of the ablated microhole arrays to about 18,000 microholes per second, which might provide a new technical guide for rapidly fabricating large-area vertical through-hole arrays in thin glass.</div></div>","PeriodicalId":49719,"journal":{"name":"Optics and Lasers in Engineering","volume":"185 ","pages":"Article 108698"},"PeriodicalIF":3.5000,"publicationDate":"2024-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optics and Lasers in Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0143816624006766","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"OPTICS","Score":null,"Total":0}
引用次数: 0
Abstract
A large-area vertical through-hole array in thin glass is rapidly fabricated by using femtosecond laser bursts assisted with chemical etching. By investigating the effects of the sub-pulse number and total pulse energy on the morphologies of the ablated microholes, as well as the effects of the chemical etching time and the concentration of HF acid solution on the morphologies of the through-holes, it is found that only under the condition that the upper surface of the glass microhole arrays is not ablated, but the exit is ablated by the femtosecond laser bursts with the increase of the sub-pulse number, a uniform and nearly vertical through-hole array can be obtained after etching in 5-wt% HF acid solution for 20 min. This single-step femtosecond laser bursts scanning method can significantly improve the fabrication efficiency of the ablated microhole arrays to about 18,000 microholes per second, which might provide a new technical guide for rapidly fabricating large-area vertical through-hole arrays in thin glass.
期刊介绍:
Optics and Lasers in Engineering aims at providing an international forum for the interchange of information on the development of optical techniques and laser technology in engineering. Emphasis is placed on contributions targeted at the practical use of methods and devices, the development and enhancement of solutions and new theoretical concepts for experimental methods.
Optics and Lasers in Engineering reflects the main areas in which optical methods are being used and developed for an engineering environment. Manuscripts should offer clear evidence of novelty and significance. Papers focusing on parameter optimization or computational issues are not suitable. Similarly, papers focussed on an application rather than the optical method fall outside the journal''s scope. The scope of the journal is defined to include the following:
-Optical Metrology-
Optical Methods for 3D visualization and virtual engineering-
Optical Techniques for Microsystems-
Imaging, Microscopy and Adaptive Optics-
Computational Imaging-
Laser methods in manufacturing-
Integrated optical and photonic sensors-
Optics and Photonics in Life Science-
Hyperspectral and spectroscopic methods-
Infrared and Terahertz techniques