{"title":"Enhanced flow boiling by manipulating two-phase flow in Tesla channel heat sink using HFE-7100","authors":"Jingwei Han, Zhaoxuan Liu, Wenming Li, Li Shan","doi":"10.1016/j.ijthermalsci.2024.109571","DOIUrl":null,"url":null,"abstract":"<div><div>Flow boiling of dielectric fluids in copper microchannel heat sinks is highly desirable for cooling large-sized insulated gate bipolar transistor (IGBT) power electronic modules. However, dielectric fluids present challenges in flow boiling because of their unfavorable thermophysical properties. These factors make it difficult to enhance critical heat flux (CHF) without precooling. To address this, we developed a large copper heat sink (10 cm × 5 cm) with Tesla microchannels designed to suppress vapor backflow and promote intense fluid mixing. The microchannels have a high length to hydrodynamic diameter ratio of approximately 220, significantly higher than those in previous studies. Flow boiling experiments using HFE-7100 were conducted for both Tesla and plain-wall microchannels. Tesla channels demonstrated a 26.2 % increase in CHF and a 120 % improvement in heat transfer coefficient (HTC). These enhancements are attributed to the vapor backflow suppression and improved fluid mixing. Moreover, the standard deviation of wall temperature in plain-wall microchannels was 10 times higher than in Tesla channels, highlighting the effectiveness of the periodic Tesla valves in reducing two-phase flow instabilities. Flow pattern visualization was conducted to further understand the mechanism behind vapor regulation, clarifying the role of Tesla valves in controlling vapor backflow. This study demonstrates the potential of dielectric fluids in Tesla microchannels for flow boiling applications, offering a promising solution for cooling large electronics.</div></div>","PeriodicalId":341,"journal":{"name":"International Journal of Thermal Sciences","volume":"210 ","pages":"Article 109571"},"PeriodicalIF":4.9000,"publicationDate":"2024-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Thermal Sciences","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1290072924006938","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Flow boiling of dielectric fluids in copper microchannel heat sinks is highly desirable for cooling large-sized insulated gate bipolar transistor (IGBT) power electronic modules. However, dielectric fluids present challenges in flow boiling because of their unfavorable thermophysical properties. These factors make it difficult to enhance critical heat flux (CHF) without precooling. To address this, we developed a large copper heat sink (10 cm × 5 cm) with Tesla microchannels designed to suppress vapor backflow and promote intense fluid mixing. The microchannels have a high length to hydrodynamic diameter ratio of approximately 220, significantly higher than those in previous studies. Flow boiling experiments using HFE-7100 were conducted for both Tesla and plain-wall microchannels. Tesla channels demonstrated a 26.2 % increase in CHF and a 120 % improvement in heat transfer coefficient (HTC). These enhancements are attributed to the vapor backflow suppression and improved fluid mixing. Moreover, the standard deviation of wall temperature in plain-wall microchannels was 10 times higher than in Tesla channels, highlighting the effectiveness of the periodic Tesla valves in reducing two-phase flow instabilities. Flow pattern visualization was conducted to further understand the mechanism behind vapor regulation, clarifying the role of Tesla valves in controlling vapor backflow. This study demonstrates the potential of dielectric fluids in Tesla microchannels for flow boiling applications, offering a promising solution for cooling large electronics.
期刊介绍:
The International Journal of Thermal Sciences is a journal devoted to the publication of fundamental studies on the physics of transfer processes in general, with an emphasis on thermal aspects and also applied research on various processes, energy systems and the environment. Articles are published in English and French, and are subject to peer review.
The fundamental subjects considered within the scope of the journal are:
* Heat and relevant mass transfer at all scales (nano, micro and macro) and in all types of material (heterogeneous, composites, biological,...) and fluid flow
* Forced, natural or mixed convection in reactive or non-reactive media
* Single or multi–phase fluid flow with or without phase change
* Near–and far–field radiative heat transfer
* Combined modes of heat transfer in complex systems (for example, plasmas, biological, geological,...)
* Multiscale modelling
The applied research topics include:
* Heat exchangers, heat pipes, cooling processes
* Transport phenomena taking place in industrial processes (chemical, food and agricultural, metallurgical, space and aeronautical, automobile industries)
* Nano–and micro–technology for energy, space, biosystems and devices
* Heat transport analysis in advanced systems
* Impact of energy–related processes on environment, and emerging energy systems
The study of thermophysical properties of materials and fluids, thermal measurement techniques, inverse methods, and the developments of experimental methods are within the scope of the International Journal of Thermal Sciences which also covers the modelling, and numerical methods applied to thermal transfer.