Enhanced integrated acoustofluidics with printed circuit board electrodes attached to piezoelectric film coated substrate

Abstract

The current key issues in applying acoustofluidics in engineering lie in the inflexibility of manufacturing processes, particularly those involving modifications to piezoelectric materials and devices. This leads to inefficient prototyping and potentially high costs. To overcome these limitations, we proposed a technique that is capable of prototyping acoustofluidic devices in a straightforward manner. This is achieved by simply clamping a printed circuit board (PCB) featuring interdigital electrodes (IDEs) onto a substrate coated with a piezoelectric thin film. By applying appropriate clamping force between the PCB and the substrate, one can effectively generate surface acoustic waves (SAWs) along the surface of the substrate. This approach simplifies the prototyping process, reducing the complexity and fabrication time. The clamping mechanism allows for easy adjustment and optimization of the SAW generation, enabling fine-tuning of the fluid and particle manipulation capabilities. Furthermore, this method allows for customizable interdigital transducers (IDTs) by ‘patterning’ IDEs on thin-film piezoelectric substrates (such as ZnO/Al and ZnO/Si) with various anisotropy orientations. This facilitates the on-demand generation of wave modes, including A0 and S0 Lamb waves, Rayleigh waves, and Sezawa waves. One notable advantage of this method is its capability to rapidly test acoustic wave patterns and performance on any substrate, offering a fast and streamlined approach to assess acoustic behaviors across diverse materials, thereby paving the way for efficient exploration of novel materials in SAW technology.