Inspired corrosion resistance of copper mediated by multiple ethoxy units linker included indazole based bis-Schiff base dyes in NaCl solution

IF 4.9 2区 化学 Q2 CHEMISTRY, PHYSICAL
Sijun Xu , Huilong Jian , Yufeng Chen , Fang Gao , Xinchao Wang , Hongru Li
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引用次数: 0

Abstract

In this study, hydrophilic multiple ethoxy units linkage chain included bis-Schiff base dyes (SBs 1–3) were designed and synthesized for strengthening corrosion resistance of copper in NaCl solution. The corrosion resistance and corrosion inhibition mechanism of the target dyes for copper were investigated in 3.0 wt% NaCl solution. The adsorption of these dyes on copper surface was revealed by Fourier transform infrared spectroscopy (FT-IR) and X-ray photoelectron spectroscopy (XPS) revealed the adsorption of these dyes containing CN double bonds on copper surface, achieving excellent corrosion inhibition efficiency. The electrochemistry shows that the dyes were able to inhibit the corrosion of copper in sodium chloride solution, and the corrosion inhibition efficiency reached the peak value at a concentration of 1.00 mM. It is noted that the corrosion inhibition efficiency increased with the number increase of ethoxy units. The kinetic potential polarization curves indicate that the dyes were anodic corrosion inhibitors, which could inhibit the anodic reaction process of corrosion. The adsorption of corrosion inhibitor these dyes on copper surface followed Langmuir isothermal adsorption model.
含吲哚唑双希夫碱染料的多乙氧基连接剂介导铜在NaCl溶液中的激发耐蚀性
本研究设计并合成了含双希夫碱染料(SBs 1-3)的亲水多乙氧基连接链,以增强铜在NaCl溶液中的耐腐蚀性。研究了目标染料在3.0 wt% NaCl溶液中对铜的耐蚀性和缓蚀机理。傅里叶变换红外光谱(FT-IR)和x射线光电子能谱(XPS)揭示了这些含有CN双键的染料在铜表面的吸附,取得了优异的缓蚀性。电化学结果表明,该染料对铜在氯化钠溶液中的腐蚀有抑制作用,在浓度为1.00 mM时,其缓蚀效率达到峰值。结果表明,随着乙氧基单元数量的增加,缓蚀效率提高。动力学电位极化曲线表明染料是阳极缓蚀剂,能抑制腐蚀的阳极反应过程。缓蚀剂在铜表面的吸附符合Langmuir等温吸附模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
8.70
自引率
9.60%
发文量
2421
审稿时长
56 days
期刊介绍: Colloids and Surfaces A: Physicochemical and Engineering Aspects is an international journal devoted to the science underlying applications of colloids and interfacial phenomena. The journal aims at publishing high quality research papers featuring new materials or new insights into the role of colloid and interface science in (for example) food, energy, minerals processing, pharmaceuticals or the environment.
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