A new parameter unifying criterion for rectangular surface structure influences on vaporization nucleation: A molecular dynamics study

Abstract

This study investigates the nucleation behavior on nanostructured surfaces and its impact on heat transfer efficiency. The significance of this research lies in the fact that accurate characterization of surface effects is crucial for optimizing heat transfer systems, which have profound implications for various industrial applications. Using molecular dynamics methods, we systematically analyze the influence of rectangular surface structures with varying heights, widths, and densities on nucleation behavior. Our findings reveal that traditional surface roughness metrics fail to capture critical surface details, limiting their ability to accurately describe the effects of different surfaces on nucleation. Furthermore, we observe that surface structures significantly influence nucleation by altering local liquid film thicknesses. To address these limitations, we propose a novel parameter that combines corrected effective liquid film thickness with surface roughness to provide a more comprehensive characterization of the nucleation process. Through computational modeling, we validate the effectiveness of this parameter in predicting heat flux density, heat transfer coefficient, and surface thermal resistance across different rectangular surface structures. The results of this study clarify the mechanisms through which surface structures affect nucleation, offering a more precise tool for characterizing these effects. This enhanced understanding not only advances the theoretical framework of nucleation science but also has practical implications for the design of more efficient heat transfer systems in various industrial settings. The novelty of this work lies in the introduction of a new parameter that surpasses previous efforts in the literature by providing a more accurate quantitative prediction of the impact of surface structures on nucleation and heat transfer efficiency.