Cooling electronic components by using nanofluids: a review

Abstract

Electronic components cooling (ECC) for manufacturing and technological uses has become one of the most interesting topics that researchers have focused in the modern era. Because of the continuous minimization in the electronic components size and substantial quantity of heat generation; the traditional cooling methods cannot be able to follow rapidly reduction in such high amount of heat flux. The use of nanofluid is an intriguing possibility for ECC. Such advancements may result in advancements in the field of electronic equipment in addition to improved efficiency of energy. The present article proposes is to study the use of various types of nanofluids over different shapes for preventing redundant heat, to effectively control the thermal stress as well as to maintain the electronic components temperature. Some fascinating features related to utilizing nanofluids to ECC are also addressed. In addition, further study prospects and directions in this area are put forward. It can be noticed that the addition of γ-Al₂O₃ NPs in water increases the heat transmission efficiency by 37% and 28%, while keeping Reynolds numbers (Re = 601.3 and 210) respectively. The cooling ability of the automobile radiator upsurges up to 17.46% with the addition of Al₂O₃-NPs.