Fast fabrication of high thermal conductivity copper-diamond composites via DC electrodeposition with simple electrolyte formula

IF 5.5 3区 工程技术 Q1 ENGINEERING, CHEMICAL
Pengfei Su , Yang Peng , Zhirui Xu , Qing Wang , Mingxiang Chen
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引用次数: 0

Abstract

Background

High heat flux probably causes serious reliability issues in power device packaging due to the low thermal performance and thermal mismatch of traditional packaging materials. Copper-diamond composite material has high thermal conductivity (TC) and low thermal stress but still faces shortcomings in preparation efficiency, heterogeneous interface quality, and dissatisfactory TC using existing electrodeposition technology.

Methods

A novel electrolyte with a simple formulation appropriate for high-rate defect-free copper-diamond composite electrodeposition was proposed. The properties of the electrolyte were evaluated by electrochemical measurements and contact angle tests, the electrodeposition process parameters were systematically optimized, and the quality and thermal characteristics of the composite coating were elaborately appraised.

Significant Findings

The electrolyte could withstand high current density and presented excellent wettability with diamond particles. Through optimizing the current density to 4 A/dm2 (ASD), the copper-diamond composite was fast fabricated at an average rate of over 90 μm/h, along with a smooth, uniform, and bright grain refined (18.6 nm) copper matrix. High concentration diamond particles were evenly distributed in the copper matrix without defects at the copper-diamond heterogeneous interface. These improvements jointly promote the efficient preparation of copper-diamond composites with high TC (638 W/(m·K)) and low CTE (9.94 × 10–6 / °C), thereby expediting the thermal performance and reliability of high heat flux device packaging substrate while boosting effectiveness.

Abstract Image

利用简单的电解质配方,通过直流电沉积快速制备高导热铜-金刚石复合材料
背景由于传统封装材料的热性能低和热不匹配,高热通量可能会导致功率器件封装出现严重的可靠性问题。铜-金刚石复合材料具有高热导率(TC)和低热应力的特点,但在现有的电沉积技术中仍面临制备效率低、界面质量不均匀、TC 不理想等缺点。通过电化学测量和接触角测试评估了电解液的特性,系统优化了电沉积工艺参数,并对复合镀层的质量和热特性进行了详细评估。通过优化电流密度至 4 A/dm2 (ASD),铜-金刚石复合材料以平均超过 90 μm/h 的速度快速制备,铜基体光滑、均匀、晶粒细化(18.6 nm)。高浓度金刚石颗粒均匀分布在铜基体中,铜-金刚石异质界面无缺陷。这些改进共同促进了高 TC(638 W/(m-K))和低 CTE(9.94 × 10-6 /°C)铜-金刚石复合材料的高效制备,从而在提高效率的同时加快了高热通量器件封装基板的热性能和可靠性。
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来源期刊
CiteScore
9.10
自引率
14.00%
发文量
362
审稿时长
35 days
期刊介绍: Journal of the Taiwan Institute of Chemical Engineers (formerly known as Journal of the Chinese Institute of Chemical Engineers) publishes original works, from fundamental principles to practical applications, in the broad field of chemical engineering with special focus on three aspects: Chemical and Biomolecular Science and Technology, Energy and Environmental Science and Technology, and Materials Science and Technology. Authors should choose for their manuscript an appropriate aspect section and a few related classifications when submitting to the journal online.
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