Improving the Density and Electrical Properties of Self-Reducing Reactive Silver Inks by Suppressing Complexing Agent Evaporation

IF 4.3 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Steven J. DiGregorio, Mary Pat Nicodemus and Owen J. Hildreth*, 
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Abstract

Self-reducing reactive silver inks are promising for printed electronics due to their low processing temperatures, high performance, and prolonged shelf life. Previous research showed that dense, high-quality silver can be printed without needing any postprint sintering steps by preferentially growing silver at the ink–substrate interface while also minimizing silver growth at the ink–vapor interface. This work builds on this concept and highlights importances of suppressing complexing agent evaporation rate to improve ink performance. By suppressing complexing agent evaporation increases silver formation at the ink–substrate interface, electrical conductivity improvement by over 2.5× for some ink formulations. Two independent studies demonstrate the benefits of this approach: one compares inks synthesized with varying vapor pressure complexing agents and the other prints inks in a complexing agent-rich environment to slow evaporation rates. Both approaches consistently yielded denser silver with lower resistances. For instance, using a propylamine complexing agent instead of ammonia at 40 °C resulted in a 96% decrease in resistance. Additionally, the ink printed at 100 °C with propylamine achieved state-of-the-art conductivity equivalent to 80% of bulk silver’s conductivity. The results confirm that slower complexing agent evaporation rates lead to denser silver with significantly lower resistances. This work introduces a unique strategy for enhancing ink performance that differs from conventional methods such as elevated temperatures, ink chemistry alterations, or postprocessing. The significantly improved low-temperature performance may broaden the applications of reactive silver inks and inspire future strategies that leverage suppressed complexing agent evaporation.

Abstract Image

通过抑制络合剂蒸发改善自还原反应银墨的密度和电性能
自还原反应银油墨具有加工温度低、性能高、保存期长等优点,因此在印刷电子产品中大有可为。先前的研究表明,通过在油墨-基底界面优先生长银,同时尽量减少油墨-蒸气界面的银生长,无需任何印后烧结步骤即可印制出致密的高质量银。这项工作以这一概念为基础,强调了抑制络合剂蒸发率对改善油墨性能的重要性。通过抑制络合剂的蒸发,增加了油墨-基底界面的银形成,某些油墨配方的导电率提高了 2.5 倍以上。两项独立的研究证明了这种方法的优势:一项研究比较了使用不同蒸汽压络合剂合成的油墨,另一项研究在富含络合剂的环境中印刷油墨,以减缓蒸发速度。这两种方法都能获得更致密、电阻更低的银。例如,在 40 °C 下使用丙胺络合剂而不是氨,电阻降低了 96%。此外,在 100 °C 下使用丙胺印刷的油墨达到了最先进的导电性,相当于块银导电性的 80%。结果证实,较慢的络合剂蒸发速度可使银更致密,电阻显著降低。这项研究提出了一种独特的提高油墨性能的策略,它不同于传统的方法,如升高温度、改变油墨化学成分或进行后处理。明显改善的低温性能可能会拓宽活性银油墨的应用范围,并启发未来利用抑制络合剂蒸发的策略。
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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