Heterodimensional structure with enhanced interface loss for microwave absorption and EMI shielding

IF 6.8 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Science China Materials Pub Date : 2024-11-06 DOI:10.1007/s40843-024-3164-1

Hong-Zhou Guan (, ), Zhan-Zhan Wang (, ), Meng-Qi Wang (, ), Hua-Zhang Zhai (, ), Mao-Sheng Cao (, )

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Abstract

The study of high-performance multifunctional electromagnetic materials is one of the inevitable challenges in the field of electromagnetic wave (EMW) absorption. In order to improve the attenuation ability of EMW and broaden the frequency range of absorbing materials, rational design of material structure and interface is an important way to optimize the effective absorption bandwidth (EAB). Therefore, enhanced-interface and strongly polarized CuS/Ti₃C₂T_X composites were successfully synthesized by in-situ etching, sacrificial template and freeze-drying techniques. Its EMW absorption performance was improved by optimizing the hybridization ratio and loading content. The maximum reflection loss of CuS@Ti₃C₂T_X (mass ratio = 5:5) is −54.6 dB and the maximum EAB covering the major of Ku band is 4.72 GHz due to the interface polarization, multiple scattering and dipole polarization. In addition, the electromagnetic interference shielding performance of CuS@Ti₃C₂T_X (mass ratio = 3:7) is up to 23.9 dB. A new heterodimensional structure was developed by the spherical structure and lamellar, which realizes the broadband EMW absorption and electromagnetic protection.

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用于微波吸收和电磁干扰屏蔽的具有增强界面损耗的异维结构

研究高性能多功能电磁材料是电磁波吸收领域不可避免的挑战之一。为了提高电磁波的衰减能力，拓宽吸波材料的频率范围，合理设计材料结构和界面是优化有效吸波带宽（EAB）的重要途径。因此，通过原位刻蚀、牺牲模板和冷冻干燥技术，成功合成了增强界面和强极化的 CuS/Ti3C2TX 复合材料。通过优化杂化率和负载量，其电磁波吸收性能得到了改善。由于界面极化、多重散射和偶极极化作用，CuS@Ti3C2TX（质量比 = 5:5）的最大反射损耗为 -54.6 dB，覆盖 Ku 波段主要频段的最大 EAB 为 4.72 GHz。此外，CuS@Ti3C2TX（质量比 = 3:7）的电磁干扰屏蔽性能高达 23.9 dB。通过球形结构和层状结构开发出了一种新型异维结构，实现了宽带电磁波吸收和电磁防护。

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来源期刊

Science China Materials Materials Science-General Materials Science

CiteScore

11.40

自引率

7.40%

发文量

949

期刊介绍： Science China Materials (SCM) is a globally peer-reviewed journal that covers all facets of materials science. It is supervised by the Chinese Academy of Sciences and co-sponsored by the Chinese Academy of Sciences and the National Natural Science Foundation of China. The journal is jointly published monthly in both printed and electronic forms by Science China Press and Springer. The aim of SCM is to encourage communication of high-quality, innovative research results at the cutting-edge interface of materials science with chemistry, physics, biology, and engineering. It focuses on breakthroughs from around the world and aims to become a world-leading academic journal for materials science.