Real-time reliability evaluation method for IGBT module in MMC based on junction temperature and bond wire failure online monitoring

IF 1.7 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

IET Power Electronics Pub Date : 2024-10-24 DOI:10.1049/pel2.12806

Zhonghao Dongye, Wuyu Zhang, Lei Qi, Bowen Gu, Hong Shen, Xiangyu Zhang, Xiang Cui

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引用次数: 0

Abstract

The lack of an MMC reliability evaluation approach that incorporates data on essential components' health monitoring in the already related research prevents reliability from being further improved. Therefore, this article proposes a real-time reliability evaluation method of the multi-state IGBT module in MMC through iterative calculation of the Markov chain model. The degradation process of the IGBT module is divided into multiple states based on the monitored bond wire failure, and the failure rate of the IGBT module is updated in real time using the accumulated monitoring data of junction temperature. The proposed method can more accurately reflect the real state of MMC compared with the binary state evaluation method. Besides, a multi-channel high-speed data acquisition board is designed to measuring the gate voltage and collector voltage of the IGBT for the health evaluation of IGBT modules in MMC; the typically measured results validate the effectiveness of the data acquisition board.

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基于结温和键合导线失效在线监测的 MMC 中 IGBT 模块实时可靠性评估方法

在已有的相关研究中，缺乏一种结合重要组件健康监测数据的 MMC 可靠性评估方法，导致可靠性无法得到进一步提高。因此，本文通过马尔科夫链模型的迭代计算，提出了一种 MMC 中多态 IGBT 模块的实时可靠性评估方法。根据监测到的键合导线失效情况，将 IGBT 模块的退化过程划分为多个状态，并利用积累的结温监测数据实时更新 IGBT 模块的失效率。与二进制状态评估方法相比，所提出的方法能更准确地反映 MMC 的真实状态。此外，还设计了一种多通道高速数据采集板，用于测量 IGBT 的栅极电压和集电极电压，以评估 MMC 中 IGBT 模块的健康状况；典型的测量结果验证了数据采集板的有效性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IET Power Electronics ENGINEERING, ELECTRICAL & ELECTRONIC-

CiteScore

5.50

自引率

10.00%

发文量

195

审稿时长

5.1 months

期刊介绍： IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes: Applications: Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances. Technologies: Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies. Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials. Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems. Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques. Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material. Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest. Special Issues. Current Call for papers: Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf