Visual boiling experimental research based on lateral liquid supply structure

IF 2.6 3区工程技术 Q2 ENGINEERING, MECHANICAL

International Journal of Heat and Fluid Flow Pub Date : 2024-11-21 DOI:10.1016/j.ijheatfluidflow.2024.109664

Fei Li, Guodong Xia, Ran Li

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Abstract

The high heat transfer coefficient and critical heat flux density of thin liquid film boiling provide new ideas for enhancing boiling heat transfer, but the bottom-up liquid supply method limits its further application and development. This study is based on the experimental research results of previous researchers and adds lateral liquid supply while maintaining a lower liquid level. And thin liquid film boiling experiments were conducted on the surface of silicon under low subcooling conditions (subcooling degree: 5 K). The obtained curves were compared with the results of smooth copper surface in pool boiling experiments. Among them, thin liquid film boiling exhibits excellent HTC and higher CHF (12.26 W/cm²·K and 191.63 W/cm², respectively). Then, the bubble behavior and flow characteristics of thin liquid film boiling bubbles were visualized and the heat transfer mechanism was analyzed. The experimental results indicate that the lateral liquid supply boiling structure designed in this study has great potential for application.

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基于横向供液结构的可视沸腾实验研究

薄液膜沸腾的高传热系数和临界热通量密度为增强沸腾传热提供了新思路，但自下而上的供液方式限制了其进一步应用和发展。本研究在前人实验研究成果的基础上，在保持较低液面的前提下，增加了横向供液。并在低过冷度条件下（过冷度：5 K）在硅表面进行了薄液膜沸腾实验。所得曲线与光滑铜表面的池沸腾实验结果进行了比较。其中，薄液膜沸腾表现出优异的 HTC 和更高的 CHF（分别为 12.26 W/cm2-K 和 191.63 W/cm2）。然后，观察了薄液膜沸腾气泡的行为和流动特性，并分析了其传热机理。实验结果表明，本研究设计的横向供液沸腾结构具有很大的应用潜力。

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来源期刊

International Journal of Heat and Fluid Flow 工程技术-工程：机械

CiteScore

5.00

自引率

7.70%

发文量

131

审稿时长

33 days

期刊介绍： The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.