Interfacial electric field of CdIn2S4/CuS heterostructure induced S-scheme charge transfer for efficient photoelectrochemical water splitting

IF 3.8 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Zonghan Hu , Qi Wang , Zihang Wang , Lanlan Zhang , Chengwei Hu , Yuanhu Lei , Yupei Qiao , Bing Lv
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引用次数: 0

Abstract

Currently, the two predominant heterojunction types, namely type II and S-scheme heterojunctions, are extensively employed in photoelectrochemical (PEC) water splitting for hydrogen production. However, type II heterojunctions suffer from the drawback of diminished oxidation-reduction capability. In this work, S-scheme CdIn2S4/CuS (CIS/CuS) heterojunction nanoblocks (NBs) photoanode is constructed for the first time by a hydrothermal and the successive ionic layer adsorption and reaction (SILAR) methods. The heterojunction achieves a photocurrent density of up to 4.0 mA/cm2 at 0 V vs. Ag/AgCl, 2.37 times that of the pure CIS NBs photoanode. X-ray photoelectron spectroscopy (XPS), Tauc plots, Mott-Schottky (M − S) tests and density functional theory (DFT) calculations reveal the formation of S-scheme band structure between the interface of CIS and CuS. As a result, the significantly enhanced PEC water splitting performance of CIS/CuS NBs photoanode is attributed to the superior light absorption ability of CuS and the effective charge separation achieved by S-scheme band structure between the interface of CIS and CuS. This work also provides new ideas and strategies for designing efficient S-scheme heterostructures for efficient PEC water splitting.
CdIn2S4/CuS 异质结构的界面电场诱导 S 型电荷转移,实现高效光电化学水分离
目前,两种主要的异质结类型,即 II 型异质结和 S 型异质结,被广泛用于光电化学(PEC)水分离制氢。然而,II 型异质结存在氧化还原能力减弱的缺点。本研究首次采用水热法和连续离子层吸附和反应(SILAR)法构建了 S 型 CdIn2S4/CuS(CIS/CuS)异质结纳米块(NBs)光阳极。该异质结在 0 V 对 Ag/AgCl 时的光电流密度高达 4.0 mA/cm2,是纯 CIS NBs 光阳极的 2.37 倍。X 射线光电子能谱(XPS)、陶氏图、莫特-肖特基(M - S)测试和密度泛函理论(DFT)计算揭示了 CIS 与 CuS 界面之间形成的 S 型带结构。因此,CIS/CuS NBs 光阳极的 PEC 水分离性能的显著提高归功于 CuS 优异的光吸收能力以及 CIS 和 CuS 界面之间的 S 型带结构实现的有效电荷分离。这项研究还为设计高效 S 型异质结构以实现高效 PEC 水分离提供了新的思路和策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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