Zonghan Hu , Qi Wang , Zihang Wang , Lanlan Zhang , Chengwei Hu , Yuanhu Lei , Yupei Qiao , Bing Lv
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引用次数: 0
Abstract
Currently, the two predominant heterojunction types, namely type II and S-scheme heterojunctions, are extensively employed in photoelectrochemical (PEC) water splitting for hydrogen production. However, type II heterojunctions suffer from the drawback of diminished oxidation-reduction capability. In this work, S-scheme CdIn2S4/CuS (CIS/CuS) heterojunction nanoblocks (NBs) photoanode is constructed for the first time by a hydrothermal and the successive ionic layer adsorption and reaction (SILAR) methods. The heterojunction achieves a photocurrent density of up to 4.0 mA/cm2 at 0 V vs. Ag/AgCl, 2.37 times that of the pure CIS NBs photoanode. X-ray photoelectron spectroscopy (XPS), Tauc plots, Mott-Schottky (M − S) tests and density functional theory (DFT) calculations reveal the formation of S-scheme band structure between the interface of CIS and CuS. As a result, the significantly enhanced PEC water splitting performance of CIS/CuS NBs photoanode is attributed to the superior light absorption ability of CuS and the effective charge separation achieved by S-scheme band structure between the interface of CIS and CuS. This work also provides new ideas and strategies for designing efficient S-scheme heterostructures for efficient PEC water splitting.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.