A novel physical vapor deposition setup applying high-frequency currents: Deposition of Cu thin films

IF 3.8 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Vacuum Pub Date : 2024-11-16 DOI:10.1016/j.vacuum.2024.113839

Ioannis A. Poimenidis , Michalis Liapakis , Argyro Klini , Maria Farsari , Stavros D. Moustaizis , Michalis Konsolakis , Panagiotis A. Loukakos

引用次数: 0

Abstract

A pioneering laboratory apparatus of physical vapor deposition (PVD) for thin film fabrication is herein introduced. This innovative setup harnesses high-frequency currents (Eddy currents) and a Zero-Voltage Switching (ZVS) heater to sublimate the sacrificial material. The as-fabricated system offers low energy consumption and fast deposition time, leading to the formation and growth of thin films in various thicknesses. To reveal its effectiveness, Cu thin films were deposited on Si wafers. Morphological, structural, and surface profile characterizations confirmed the growth of thin films consisting of Cu nanoparticles. Also, a parametric study of deposition time was conducted to determine the optimum conditions for the thin film fabrication.

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应用高频电流的新型物理气相沉积装置：铜薄膜的沉积

本文介绍了一种用于薄膜制造的开创性物理气相沉积（PVD）实验室设备。这种创新装置利用高频电流（涡流）和零电压开关（ZVS）加热器来升华牺牲材料。制造完成的系统能耗低、沉积时间快，可形成和生长各种厚度的薄膜。为了揭示其有效性，我们在硅晶片上沉积了铜薄膜。对形态、结构和表面轮廓的表征证实了由铜纳米颗粒组成的薄膜的生长。此外，还对沉积时间进行了参数研究，以确定薄膜制造的最佳条件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Vacuum 工程技术-材料科学：综合

CiteScore

6.80

自引率

17.50%

发文量

审稿时长

34 days

期刊介绍： Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.