Morphological and quality assessments of unary and binary base immersion-fabricated cupric/cuprous oxide nanoflake-coated copper

IF 2.5 Q2 CHEMISTRY, MULTIDISCIPLINARY

Results in Chemistry Pub Date : 2024-11-17 DOI:10.1016/j.rechem.2024.101908

Ricky Kristan M. Raguindin

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Abstract

Mass production practicable fabrication techniques for wide-application-ranged cupric oxide (CuO) or cuprous oxide (Cu₂O) nanostructures are crucial in its research-to-technology thrust. Films of CuO/Cu₂O were grown onto copper as coating via a 16-day unary or binary immersion to solutions of barium hydroxide (Ba(OH)₂) and/or potassium hydroxide (KOH) with varying concentration proportions. Physical inspection and Raman spectroscopy confirms the identity of the grown films to be CuO for all specimens under study except for the copper foil immersed in unary KOH wherein CuO coexists with Cu₂O. Scanning electron microscopy and energy dispersive X-ray spectroscopy (SEM-EDX) reveals the nanoflake morphology of the oxide layers with minimal traces of impurities (maximum impurity: 4.17 At.%) and the abundance of oxygen atoms (41.14–55.68 At.%) among the samples. Copper-to-oxygen ratio of the samples ranged from 0.7 to 1.41. Moreover, analysis of variance (ANOVA) reveals the significant differences of the film and flake thicknesses among the specimens under study. The average nanoflake thickness increases as Ba(OH)₂ amount is decreased as opposed to KOH up to the binary immersed sample with equal component proportions (maximum average: 71.7 nm), then decreases as KOH concentration is increased in expense of Ba(OH)₂ (minimum average: 29.5 nm). The average film thickness is highest for the 75-Ba(OH)₂:25-KOH immersed foil and a decreasing trend is apparent as KOH is further increased at the expense of Ba(OH)₂. Preliminary assessments may qualify the fabricated oxide nanoflakes on copper for potential applications.

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单基和双基浸渍法制造的铜/氧化亚铜纳米片涂层铜的形态和质量评估

大规模生产应用广泛的氧化铜（CuO）或氧化亚铜（Cu2O）纳米结构的实用制造技术对其从研究到技术的发展至关重要。通过在不同浓度比例的氢氧化钡（Ba(OH)2）和/或氢氧化钾（KOH）溶液中进行为期 16 天的单相或双相浸泡，在铜镀层上生长出 CuO/Cu2O 薄膜。物理检查和拉曼光谱证实，除了浸泡在单质氢氧化钾溶液中的铜箔（CuO 与 Cu2O 共存）外，所有研究对象的生长薄膜都是 CuO。扫描电子显微镜和能量色散 X 射线光谱（SEM-EDX）显示了氧化物层的纳米片状形态，杂质含量极低（最大杂质含量：4.17 At.%），样品中氧原子含量丰富（41.14-55.68 At.%）。样品的铜氧比在 0.7 至 1.41 之间。此外，方差分析（ANOVA）显示，所研究样品的薄膜和薄片厚度存在显著差异。在成分比例相同的二元浸渍样品中，随着 Ba（OH）2 用量的减少，平均纳米薄片厚度增加（最大平均值：71.7 nm），而随着 KOH 浓度的增加，平均纳米薄片厚度减小（最小平均值：29.5 nm）。75-Ba（OH）2:25-KOH 浸渍箔的平均薄膜厚度最大，随着 KOH 浓度的进一步增加，以 Ba（OH）2 为代价，薄膜厚度呈明显的下降趋势。初步评估表明，在铜上制造的氧化物纳米片具有潜在的应用价值。

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