Component temperature analysis in power modules: Coupling with power loss evaluation and thermal network models considering thermal diffusion effects

Abstract

Electronic components often encounter issues such as performance degradation and thermal damage due to inherent heat generation during operation. Hence, ensuring their quality relies on scientific thermal design. In this study, we proposed a novel temperature analysis approach that integrates power loss assessment and thermal network modeling, with the consideration of thermal diffusion effects for power module components. Reliable heat flux is obtained by analyzing the power loss of circuit units based on the component operation mechanism. Additionally, we established a thermal network model for temperature analysis of the component, which consumes less than 0.04 % of the time compared with CFD simulation. Moreover, the model incorporates thermal diffusion effects within the package structure, enhancing temperature calculation accuracy. The findings demonstrate that combining power loss assessment and thermal network modeling yields more reliable temperature calculations, substantially reduces computation time, and lowers thermal design costs, providing valuable insights for electronic component thermal design processes.