Study of thermal annealing on gallium oxide heteroepitaxial layers grown on SiC for vertical Schottky barrier diodes applications

IF 7.5 Q1 CHEMISTRY, PHYSICAL
Chai-Wei Ku , Sheng-Ti Chung , Fu-Gow Tarntair , Ching-Lien Hsiao , Ray-Hua Horng
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Abstract

This study successfully grew ꞵ-Ga2O3 epitaxial films on silicon carbide substrates by metalorganic chemical vapor deposition and fabricated vertical Schottky barrier diodes (SBDs), which were annealed in a high temperature furnace. The high surface roughness and oxygen vacancies of the unannealed device caused a large leakage current, thus three different annealing durations were used to repair the surface oxygen vacancies in an O2:N2=1:4 gas environment. The results showed that a 5-minute thermal annealing process was the most effective in repairing surface oxygen vacancies. According to the X-ray photoelectron spectroscopy spectra of the O 1 s core levels in Ga2O3 epilayers, the proportion of oxygen vacancies decreased from 56.56 % to 49.71 %. Additionally, the leakage current density was decreased from 10−3 to 10−5 A/cm2 and the surface roughness decreases to 32.6 nm due to stress release. Furthermore, the barrier heights (φb) of the SBDs without annealing, and after annealed for 5, 20, and 40 min were measured at 0.911, 1.229, 1.090, and 1.115 eV, respectively. It was observed that the SBD fabricated on the epilayer annealed for 5 min exhibited the lowest leakage current (approximately 2 × 10⁻⁵ A/cm²) and the highest breakdown voltage, measuring around 132 V.
用于垂直肖特基势垒二极管应用的碳化硅上生长的氧化镓异质外延层的热退火研究
本研究通过金属有机化学气相沉积法在碳化硅衬底上成功生长了ꞵ-Ga2O3 外延薄膜,并制作了垂直肖特基势垒二极管(SBD),然后将其放入高温炉中退火。未退火器件的高表面粗糙度和氧空位导致了较大的漏电流,因此在 O2:N2=1:4 气体环境中使用了三种不同的退火持续时间来修复表面氧空位。结果表明,5 分钟的热退火过程对修复表面氧空位最有效。根据 Ga2O3 磊晶片中 O 1 s 核级的 X 射线光电子能谱图,氧空位的比例从 56.56% 降至 49.71%。此外,由于应力释放,漏电流密度从 10-3 A/cm2下降到 10-5 A/cm2,表面粗糙度下降到 32.6 nm。此外,还测量了未退火和退火 5、20 和 40 分钟后 SBD 的势垒高度(φb),分别为 0.911、1.229、1.090 和 1.115 eV。据观察,在退火 5 分钟的外延层上制造的 SBD 的漏电流最低(约为 2 × 10-⁵ A/cm²),击穿电压最高,约为 132 V。
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来源期刊
CiteScore
8.10
自引率
1.60%
发文量
128
审稿时长
66 days
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