Analysis of OLED glass substrate heated by heating tube array based on multiple optimization algorithms

IF 5.1 3区工程技术 Q2 ENERGY & FUELS

Thermal Science and Engineering Progress Pub Date : 2024-11-14 DOI:10.1016/j.tsep.2024.103053

Yiyi Wang , Chang Xu , Huikun Cai

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Abstract

The temperature uniformity of OLED glass substrate during heat treatment is a key factor affecting the quality of its imaging display. This paper constructs the heating process model of OLED glass substrate based on heating tube array according to the actual scene, studies the thermal characteristics of OLED glass substrate, and then optimizes the temperature uniformity of glass substrate under isometric heating mode based on genetic algorithm, particle swarm optimization algorithm and simulated annealing algorithm. Compared with the initial solution of the algorithm, the optimization rates of the three algorithms respectively reach 75.5%, 86.4% and 98.3%, and the temperature differences are reduced to 3.82℃, 1.44℃ and 0.30℃. Finally, an experimental platform is built to verify the optimization results of different algorithms. The absolute errors are 0.58℃, 1.46℃, 1.30℃ respectively, all lower than 1.5℃, which is within the allowable range of process requirements. It is proved that the proposed optimization algorithm control mode can reduce the heating temperature difference of glass substrate to the ideal level based on the heating device with low cost and simple structure. This scheme provides some reference for the formulation of temperature distribution solution in heat pipe heating technology.

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基于多重优化算法的加热管阵列加热 OLED 玻璃基板分析

OLED 玻璃基板在热处理过程中的温度均匀性是影响其成像显示质量的关键因素。本文根据实际场景，构建了基于加热管阵列的 OLED 玻璃基板加热工艺模型，研究了 OLED 玻璃基板的热特性，并基于遗传算法、粒子群优化算法和模拟退火算法对等距加热模式下玻璃基板的温度均匀性进行了优化。与算法初始解相比，三种算法的优化率分别达到 75.5%、86.4% 和 98.3%，温差分别降低到 3.82℃、1.44℃ 和 0.30℃。最后，建立了一个实验平台来验证不同算法的优化结果。绝对误差分别为 0.58℃、1.46℃、1.30℃，均小于 1.5℃，在工艺要求的允许范围内。实践证明，基于成本低廉、结构简单的加热装置，所提出的优化算法控制模式可将玻璃基板的加热温差降至理想水平。该方案为热管加热技术中温度分布方案的制定提供了一定的参考。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

7.20

自引率

10.40%

发文量

327

审稿时长

41 days

期刊介绍： Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.