Electrochemical properties of CuxCo1-xFe2O4 nanoparticles via cationic substitution for supercapacitor applications

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Prashant N. Nikam, Sharadchandra S. Patil, Umesh M. Chougale, Akash V. Fulari, Vijay J. Fulari
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Abstract

This study presents the synthesis of CuxCo1-xFe2O4 nanoparticles as potential supercapacitor electrode materials via a sol–gel auto-combustion process. The electrochemical properties were systematically evaluated as Cu was gradually substituted with Co. Using 1 M KOH electrolyte, we characterized the electrochemical performance of CuxCo1-xFe2O4 through cyclic voltammetry (CV), galvanostatic charge–discharge (GCD), and electrochemical impedance spectroscopy (EIS). Among the compositions, Cu0.5Co0.5Fe2O4 spinel ferrite nanoparticles demonstrated an impressive specific capacitance of 1755 F/g at a current density of 5 mA/cm2, along with a power density of 320 W/kg and an energy density of 38.40 Wh/kg. Additionally, the supercapacitor showcased remarkable cycling stability, retaining over 88.60% of its initial capacitance after 5000 GCD cycles. These findings suggest that CuxCo1-xFe2O4 is a highly promising candidate for supercapacitor applications.

Abstract Image

通过阳离子取代实现 CuxCo1-xFe2O4 纳米粒子的电化学特性,用于超级电容器应用
本研究介绍了通过溶胶-凝胶自燃烧工艺合成 CuxCo1-xFe2O4 纳米粒子作为潜在的超级电容器电极材料。随着 Cu 逐渐被 Co 取代,系统地评估了其电化学特性。使用 1 M KOH 电解液,我们通过循环伏安法(CV)、电静态充放电法(GCD)和电化学阻抗谱法(EIS)对 CuxCo1-xFe2O4 的电化学性能进行了表征。在这些成分中,Cu0.5Co0.5Fe2O4 尖晶石铁氧体纳米粒子在 5 mA/cm2 的电流密度下显示出令人印象深刻的 1755 F/g 比电容,功率密度为 320 W/kg,能量密度为 38.40 Wh/kg。此外,该超级电容器还表现出显著的循环稳定性,在 5000 次 GCD 循环后,其初始电容保持率超过 88.60%。这些研究结果表明,CuxCo1-xFe2O4 是超级电容器应用中极具潜力的候选材料。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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