Effects of In2O3 and Ta2O5 co-doping on microstructure and electrical properties of ZnO low-voltage varistor

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Hua Man, Xi Wang, Banglun Wang, Mengyang Shi, Ming Jiang, Dong Xu
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Abstract

In this work, ZnO–Bi2O3 based low-voltage varistors were prepared by co-doping of In2O3 and Ta2O5, which achieved a high nonlinear coefficient with a low breakdown voltage. By exploring the microstructure and electrical performance of the samples, it was found that the samples co-doped with In2O3 and Ta2O5 have uniform microstructure, and the threshold voltage decreased slightly while the leakage current decreased. The best performance of the varistor was obtained at 0.15 mol% Ta2O5 doping with a breakdown voltage of 184 V/mm, a nonlinear coefficient of 32.3 and a leakage current of 0.04 μA. The grain boundary resistance of the varistor increased after the co-doping of In2O3 and Ta2O5, which was conducive to improving performance stability of the sample. All varistors could be aged, but the parameter change rate of doped varistors was significantly smaller.

Abstract Image

In2O3 和 Ta2O5 共掺杂对氧化锌低压变阻器微观结构和电气性能的影响
本研究通过共掺杂 In2O3 和 Ta2O5 制备了基于 ZnO-Bi2O3 的低压压敏电阻,实现了高非线性系数和低击穿电压。通过探究样品的微观结构和电学性能,发现共掺杂 In2O3 和 Ta2O5 的样品具有均匀的微观结构,阈值电压略有下降,而漏电流则有所下降。掺杂 0.15 mol% Ta2O5 时压敏电阻的性能最佳,击穿电压为 184 V/mm,非线性系数为 32.3,漏电流为 0.04 μA。In2O3 和 Ta2O5 共掺杂后,压敏电阻的晶界电阻增大,有利于提高样品的性能稳定性。所有压敏电阻都可以老化,但掺杂压敏电阻的参数变化率明显较小。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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