Enhanced corrosion resistance and biofilm inhibition of TC4 with slight Cu addition against marine Pseudomonas aeruginosa

IF 4.8 2区 化学 Q1 BIOCHEMISTRY & MOLECULAR BIOLOGY
Shengchao Yao, Yulin Chen, Xin Zhang, Zhizhong Dong
{"title":"Enhanced corrosion resistance and biofilm inhibition of TC4 with slight Cu addition against marine Pseudomonas aeruginosa","authors":"Shengchao Yao,&nbsp;Yulin Chen,&nbsp;Xin Zhang,&nbsp;Zhizhong Dong","doi":"10.1016/j.bioelechem.2024.108852","DOIUrl":null,"url":null,"abstract":"<div><div>Ti-6Al-4V (TC4) alloy is widely utilized as the structural material in marine industries owing to its low density, high specific strength, and favorable corrosion resistance. However, as biofouling drastically alters, some reported the major deleterious effect of bacteria has imposed a challenge to improve microbiologically influenced corrosion (MIC) resistance. A further opportunity for solving this problem is Cu micro-alloying, which was inspired by adding Cu for biomedical applications. Herein, a Ti-6Al-4V alloy with slight Cu addition (TC4-Cu) was exposed to 2216E media inoculated with Pseudomonas aeruginosa (P. A.), and then investigated compared to TC4. TC4-Cu exhibits lower corrosion current, more denser passive film, and lower weight loss with weaker pitting (a maximum pitting depth of 0.2 μm), compared to TC4 with a maximum pitting crater depth of 9.6 μm. Those demonstrated that the presence of Cu significantly improved the MIC resistance, and inhibited the proliferation of P. A., leading to a good antimicrobial efficacy against marine P. A. Moreover, besides the well-known bactericidal role, Cu ions were transferred to form Cu<sub>2</sub>O and CuO, constituting protective corrosion products, and thus improving the anti-microbial properties of TC4-Cu.</div></div>","PeriodicalId":252,"journal":{"name":"Bioelectrochemistry","volume":"162 ","pages":"Article 108852"},"PeriodicalIF":4.8000,"publicationDate":"2024-11-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Bioelectrochemistry","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1567539424002147","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"BIOCHEMISTRY & MOLECULAR BIOLOGY","Score":null,"Total":0}
引用次数: 0

Abstract

Ti-6Al-4V (TC4) alloy is widely utilized as the structural material in marine industries owing to its low density, high specific strength, and favorable corrosion resistance. However, as biofouling drastically alters, some reported the major deleterious effect of bacteria has imposed a challenge to improve microbiologically influenced corrosion (MIC) resistance. A further opportunity for solving this problem is Cu micro-alloying, which was inspired by adding Cu for biomedical applications. Herein, a Ti-6Al-4V alloy with slight Cu addition (TC4-Cu) was exposed to 2216E media inoculated with Pseudomonas aeruginosa (P. A.), and then investigated compared to TC4. TC4-Cu exhibits lower corrosion current, more denser passive film, and lower weight loss with weaker pitting (a maximum pitting depth of 0.2 μm), compared to TC4 with a maximum pitting crater depth of 9.6 μm. Those demonstrated that the presence of Cu significantly improved the MIC resistance, and inhibited the proliferation of P. A., leading to a good antimicrobial efficacy against marine P. A. Moreover, besides the well-known bactericidal role, Cu ions were transferred to form Cu2O and CuO, constituting protective corrosion products, and thus improving the anti-microbial properties of TC4-Cu.

Abstract Image

添加少量铜的 TC4 可增强对海洋铜绿假单胞菌的耐腐蚀性和生物膜抑制作用。
Ti-6Al-4V(TC4)合金因其密度低、比强度高、耐腐蚀性好而被广泛用作海洋工业的结构材料。然而,随着生物污染的急剧变化,一些报道称细菌的主要有害影响给提高抗微生物影响腐蚀(MIC)带来了挑战。解决这一问题的另一个机会是铜微合金化,其灵感来自于在生物医学应用中添加铜。在此,一种添加了少量铜的 Ti-6Al-4V 合金(TC4-Cu)被暴露在接种了铜绿假单胞菌(P. A.)的 2216E 介质中,然后与 TC4 相比进行了研究。与最大点蚀坑深度为 9.6 μm 的 TC4 相比,TC4-Cu 表现出更低的腐蚀电流、更致密的被动膜、更低的重量损失和更弱的点蚀(最大点蚀深度为 0.2 μm)。此外,除了众所周知的杀菌作用外,Cu 离子还能转移形成 Cu2O 和 CuO,构成保护性腐蚀产物,从而提高 TC4-Cu 的抗微生物性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Bioelectrochemistry
Bioelectrochemistry 生物-电化学
CiteScore
9.10
自引率
6.00%
发文量
238
审稿时长
38 days
期刊介绍: An International Journal Devoted to Electrochemical Aspects of Biology and Biological Aspects of Electrochemistry Bioelectrochemistry is an international journal devoted to electrochemical principles in biology and biological aspects of electrochemistry. It publishes experimental and theoretical papers dealing with the electrochemical aspects of: • Electrified interfaces (electric double layers, adsorption, electron transfer, protein electrochemistry, basic principles of biosensors, biosensor interfaces and bio-nanosensor design and construction. • Electric and magnetic field effects (field-dependent processes, field interactions with molecules, intramolecular field effects, sensory systems for electric and magnetic fields, molecular and cellular mechanisms) • Bioenergetics and signal transduction (energy conversion, photosynthetic and visual membranes) • Biomembranes and model membranes (thermodynamics and mechanics, membrane transport, electroporation, fusion and insertion) • Electrochemical applications in medicine and biotechnology (drug delivery and gene transfer to cells and tissues, iontophoresis, skin electroporation, injury and repair). • Organization and use of arrays in-vitro and in-vivo, including as part of feedback control. • Electrochemical interrogation of biofilms as generated by microorganisms and tissue reaction associated with medical implants.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信