Ductile inorganic semiconductors for deformable electronics

IF 24.5 Q1 CHEMISTRY, PHYSICAL
Xiaocui Li, Fu-Rong Chen, Yang Lu
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Abstract

Traditionally, it is relatively easy to process metal materials and polymers (plastics), while ceramic and inorganic semiconductor materials are hard to process, due to their intrinsic brittleness caused by directional covalent bonds or the strong electrostatic interactions among ionic species. The brittleness of semiconductor materials, which may degrade their functional performance and cause catastrophic failures, has excluded them from many application scenarios. The exploration on room-temperature ductile semiconductors has been a long pursuit of mankind for fabricating deformable and more robust electronics. Guided by this goal, researchers have already found that the plasticity of brittle semiconductors can be enhanced by size effects, which include fewer pre-existing micro-cracks and increased dislocation activity, charge characteristics, and defect density. It has also been explored that a few quasi-layered/van der Waals semiconductors can have exceptional room-temperature metal-like plasticity, enabled by the relatively weak interlayer bonding and easy interlayer gliding. More recently, intrinsic exceptional plasticity has been found in a group of all-inorganic perovskites (CsPbX3, X = Cl, Br and I), which can be morphed into distinct morphologies through multislip at room temperature, without affecting their functional properties and bandgap energy. Based on the above research status, in this review, we will discuss and present the relevant works on the plasticity found in inorganic semiconductors and the proposed deformation mechanisms. The potential applications and bottlenecks of plastic semiconductors in manufacturing next-generation deformable electronic/optoelectronic devices and energy systems will also be discussed.

Abstract Image

用于可变形电子器件的延展性无机半导体
传统上,金属材料和聚合物(塑料)的加工相对容易,而陶瓷和无机半导体材料则很难加工,这是因为定向共价键或离子间的强静电作用导致了它们固有的脆性。半导体材料的脆性可能会降低其功能性能并导致灾难性故障,因此被排除在许多应用场景之外。探索室温韧性半导体是人类制造可变形和更坚固电子器件的长期追求。在这一目标的指引下,研究人员已经发现,脆性半导体的可塑性可以通过尺寸效应得到增强,包括减少预先存在的微裂缝,提高位错活性、电荷特性和缺陷密度。研究还发现,由于层间结合相对较弱,层间容易滑动,一些准层状/范德华半导体可具有类似金属的室温特殊塑性。最近,一组全无机包晶石(CsPbX3,X = Cl、Br 和 I)被发现具有内在的特殊可塑性,可在室温下通过多滑动形成不同的形态,而不影响其功能特性和带隙能。基于上述研究现状,我们将在这篇综述中讨论并介绍无机半导体塑性的相关研究工作以及所提出的变形机制。此外,还将讨论塑性半导体在制造下一代可变形电子/光电器件和能源系统方面的潜在应用和瓶颈。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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