Yihe Liu , Junjie Wang , Shuang Liu , Mingyuan Sun , Xiaoyang Zhang , Jingtao Zhou , Shiqin Yan , RuiCheng Pan , Hao Hu , Yang Liu
{"title":"Design and implementation of a charge-sharing in-memory-computing macro with sparse feature for quantized neural network","authors":"Yihe Liu , Junjie Wang , Shuang Liu , Mingyuan Sun , Xiaoyang Zhang , Jingtao Zhou , Shiqin Yan , RuiCheng Pan , Hao Hu , Yang Liu","doi":"10.1016/j.mejo.2024.106470","DOIUrl":null,"url":null,"abstract":"<div><div>With the rapid development of artificial intelligence technology, in-memory computing has become a research hotspot. In this article, we propose an in-memory computing (IMC) architecture that achieves high energy efficiency and performance. Our work is based on the working mechanism of charge sharing, enabling configurable multi-bit Multiply-Accumulate operations. This work employs a unique bit-cell structure to implement sparse strategies at the bit-level in IMC arrays and compensates for errors caused by non-ideal effects, thus achieving better energy efficiency and performance. A hardware-aware quantification method and a hardware simulation model based on Pytorch have been proposed to evaluate the hardware mapping and compare with other charge domain IMC works. The MNIST and CIFAR-10 datasets have been used to validate algorithm models and chip performance, achieving accuracy rates of 97.6% and 90.5%<!--> <!-->respectively. The IMC chip was fabricated with a 180 nm CMOS process. The measurement shows that the chip achieves an energy efficiency of 41.8 TOPS/W.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"154 ","pages":"Article 106470"},"PeriodicalIF":1.9000,"publicationDate":"2024-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239124001747","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
With the rapid development of artificial intelligence technology, in-memory computing has become a research hotspot. In this article, we propose an in-memory computing (IMC) architecture that achieves high energy efficiency and performance. Our work is based on the working mechanism of charge sharing, enabling configurable multi-bit Multiply-Accumulate operations. This work employs a unique bit-cell structure to implement sparse strategies at the bit-level in IMC arrays and compensates for errors caused by non-ideal effects, thus achieving better energy efficiency and performance. A hardware-aware quantification method and a hardware simulation model based on Pytorch have been proposed to evaluate the hardware mapping and compare with other charge domain IMC works. The MNIST and CIFAR-10 datasets have been used to validate algorithm models and chip performance, achieving accuracy rates of 97.6% and 90.5% respectively. The IMC chip was fabricated with a 180 nm CMOS process. The measurement shows that the chip achieves an energy efficiency of 41.8 TOPS/W.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.