A batch-fabricated high-density flexible coil enabled by low-temperature bonding technique

IF 4.1 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Sensors and Actuators A-physical Pub Date : 2024-11-13 DOI:10.1016/j.sna.2024.116060

Zhifei Wang , Xinyi Wang , Qinghong Zhang, Weitao Dou, Yisen Gao, Shudong Wang, Yunjia Li

引用次数: 0

Abstract

In this work, a high-density flexible coil (HFC) is designed and fabricated by stacking and bonding multiple layers of thin flexible coils. A batch fabrication process of the HFC is developed based on a low-temperature gold compression bonding technique. A Cu-Ni-Au electrode-dummy structure is implemented to realize simultaneous electrical connection and mechanical bonding between the flexible coil layers. A proof-of-concept HFC demonstrator is batch-fabricated by bonding process with temperature of 200℃ and pressure of 8 MPa. The fabricated HFC includes 500 turns of coil within a volume of 10 mm×10 mm×0.72 mm, enabling high-coil density with miniaturized footprint. The structural, electrical, and mechanical properties of the HFC are systematically characterized and discussed.

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利用低温粘接技术批量制造高密度柔性线圈

在这项工作中，通过堆叠和粘合多层薄柔性线圈，设计并制造了一种高密度柔性线圈（HFC）。基于低温金压接合技术，开发了一种批量制造 HFC 的工艺。采用铜-镍-金电偶结构实现了柔性线圈层之间的电气连接和机械粘合。通过温度为 200℃、压力为 8 兆帕的粘接工艺，批量制造出了概念验证型 HFC 演示器。制成的 HFC 包括 500 匝线圈，体积为 10 mm×10 mm×0.72 mm，实现了高线圈密度和小型化。对 HFC 的结构、电气和机械性能进行了系统的描述和讨论。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Sensors and Actuators A-physical 工程技术-工程：电子与电气

CiteScore

8.10

自引率

6.50%

发文量

630

审稿时长

49 days

期刊介绍： Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...