Multiple edge cracks in a coated semi-infinite medium due to non-Fourier thermal shock

IF 4.7 2区 工程技术 Q1 MECHANICS
Xingsheng Xu, Xuejun Chen
{"title":"Multiple edge cracks in a coated semi-infinite medium due to non-Fourier thermal shock","authors":"Xingsheng Xu,&nbsp;Xuejun Chen","doi":"10.1016/j.engfracmech.2024.110594","DOIUrl":null,"url":null,"abstract":"<div><div>In this wok, based on the non-Fourier C-V model, the problem for multiple edge cracks is investigated for a coating-substrate pair subjected to a sudden temperature drop at the surface of coating. The temperature and resulting thermal stresses without cracks are obtained by the method of Laplace transform. By numerically solving the singular integral equations, the thermal stress intensity factors (SIFs) are evaluated. The results from the Fourier model and C-V heat conduction model are presented for comparison. Two dimensionless quantities are proposed to account for the coupling effects of heat conduction parameters (i.e., thermal conductivity, thermal diffusivity, and thermal relaxation time). Numerical results are presented for the thermal SIF as a function of normalized quantities such as time, crack depth, material constants and crack spacing. The findings in this work are expected to provide references for maintaining the integrity of the coating-substrate pair in the extreme heat transfer applications.</div></div>","PeriodicalId":11576,"journal":{"name":"Engineering Fracture Mechanics","volume":"312 ","pages":"Article 110594"},"PeriodicalIF":4.7000,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Engineering Fracture Mechanics","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0013794424007574","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MECHANICS","Score":null,"Total":0}
引用次数: 0

Abstract

In this wok, based on the non-Fourier C-V model, the problem for multiple edge cracks is investigated for a coating-substrate pair subjected to a sudden temperature drop at the surface of coating. The temperature and resulting thermal stresses without cracks are obtained by the method of Laplace transform. By numerically solving the singular integral equations, the thermal stress intensity factors (SIFs) are evaluated. The results from the Fourier model and C-V heat conduction model are presented for comparison. Two dimensionless quantities are proposed to account for the coupling effects of heat conduction parameters (i.e., thermal conductivity, thermal diffusivity, and thermal relaxation time). Numerical results are presented for the thermal SIF as a function of normalized quantities such as time, crack depth, material constants and crack spacing. The findings in this work are expected to provide references for maintaining the integrity of the coating-substrate pair in the extreme heat transfer applications.
非傅里叶热冲击导致涂层半无限介质出现多条边缘裂缝
本文基于非傅里叶 C-V 模型,研究了涂层表面温度骤降时涂层-基体对的多边缘裂纹问题。通过拉普拉斯变换的方法得到了温度和由此产生的无裂缝热应力。通过数值求解奇异积分方程,评估了热应力强度因子(SIF)。傅立叶模型和 C-V 热传导模型的结果进行了比较。提出了两个无量纲量来考虑热传导参数(即热导率、热扩散率和热弛豫时间)的耦合效应。数值结果显示了热 SIF 与时间、裂纹深度、材料常数和裂纹间距等归一化量的函数关系。这项工作的研究结果有望为在极端传热应用中保持涂层-基底对的完整性提供参考。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
8.70
自引率
13.00%
发文量
606
审稿时长
74 days
期刊介绍: EFM covers a broad range of topics in fracture mechanics to be of interest and use to both researchers and practitioners. Contributions are welcome which address the fracture behavior of conventional engineering material systems as well as newly emerging material systems. Contributions on developments in the areas of mechanics and materials science strongly related to fracture mechanics are also welcome. Papers on fatigue are welcome if they treat the fatigue process using the methods of fracture mechanics.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信