Novel fluorobenzimidazole-assisted heat resistant anticorrosion copper surface for high-density interconnected printed circuit boards

IF 6.5 2区 材料科学 Q1 CHEMISTRY, APPLIED
Xuewen Zhuang , Xingshang Weng , Zhongming Chen , Weijian Chen , Zongmei Yang , Xiaochun Zhang
{"title":"Novel fluorobenzimidazole-assisted heat resistant anticorrosion copper surface for high-density interconnected printed circuit boards","authors":"Xuewen Zhuang ,&nbsp;Xingshang Weng ,&nbsp;Zhongming Chen ,&nbsp;Weijian Chen ,&nbsp;Zongmei Yang ,&nbsp;Xiaochun Zhang","doi":"10.1016/j.porgcoat.2024.108877","DOIUrl":null,"url":null,"abstract":"<div><div>Self-assembled organic films of imidazole derivatives are vital for metal surface modification, but their effectiveness in the commercialization of high-density copper interconnects remains limited. To enhance thermal and chemical stability, we synthesized five fluorobenzimidazole monomers by integrating fluorine into the imidazole structure using a solvent-free method. Notably, the 5-chloro-2-(2-chloro-4-fluorobenzyl)-1H-benzo[<em>d</em>]imidazole (5224FIM) demonstrated an impressive inhibition efficiency of 95.00 %, forming a robust barrier approximately 4450 Å thick, which effectively withstands damage under high temperature and humidity. X-ray photoelectron spectroscopy (XPS) analysis revealed that the oxygen content in sample 5442FIM was 9.02 %, the lowest among the samples, while the nitrogen content was 8.19 %, indicating a substantial presence of imidazole molecules. In comparison to non-substituted benzimidazole films, these fluorine-enhanced self-assembled films on copper exhibited superior heat and moisture resistance. Notably, printed circuit boards coated with 5224FIM demonstrated excellent performance in 72-h salt spray and 245 °C tin immersion solderability tests, highlighting their enhanced surface protection capabilities.</div></div>","PeriodicalId":20834,"journal":{"name":"Progress in Organic Coatings","volume":"198 ","pages":"Article 108877"},"PeriodicalIF":6.5000,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Progress in Organic Coatings","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0300944024006696","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, APPLIED","Score":null,"Total":0}
引用次数: 0

Abstract

Self-assembled organic films of imidazole derivatives are vital for metal surface modification, but their effectiveness in the commercialization of high-density copper interconnects remains limited. To enhance thermal and chemical stability, we synthesized five fluorobenzimidazole monomers by integrating fluorine into the imidazole structure using a solvent-free method. Notably, the 5-chloro-2-(2-chloro-4-fluorobenzyl)-1H-benzo[d]imidazole (5224FIM) demonstrated an impressive inhibition efficiency of 95.00 %, forming a robust barrier approximately 4450 Å thick, which effectively withstands damage under high temperature and humidity. X-ray photoelectron spectroscopy (XPS) analysis revealed that the oxygen content in sample 5442FIM was 9.02 %, the lowest among the samples, while the nitrogen content was 8.19 %, indicating a substantial presence of imidazole molecules. In comparison to non-substituted benzimidazole films, these fluorine-enhanced self-assembled films on copper exhibited superior heat and moisture resistance. Notably, printed circuit boards coated with 5224FIM demonstrated excellent performance in 72-h salt spray and 245 °C tin immersion solderability tests, highlighting their enhanced surface protection capabilities.

Abstract Image

用于高密度互连印刷电路板的新型氟苯并咪唑辅助耐热防腐铜表面
咪唑衍生物自组装有机薄膜对金属表面改性至关重要,但其在高密度铜互连器件商业化中的有效性仍然有限。为了提高热稳定性和化学稳定性,我们采用无溶剂方法将氟融入咪唑结构中,合成了五种氟苯并咪唑单体。值得注意的是,5-氯-2-(2-氯-4-氟苄基)-1H-苯并[d]咪唑(5224FIM)的抑制效率高达 95.00%,形成了约 4450 Å 厚的坚固屏障,能有效抵御高温高湿环境下的损坏。X 射线光电子能谱(XPS)分析表明,样品 5442FIM 中的氧含量为 9.02%,是所有样品中最低的,而氮含量为 8.19%,表明其中含有大量咪唑分子。与非取代的苯并咪唑薄膜相比,这些氟增强型铜自组装薄膜具有优异的耐热性和防潮性。值得注意的是,涂有 5224FIM 的印刷电路板在 72 小时盐雾和 245 °C 锡浸泡可焊性测试中表现出色,突显了其增强的表面保护能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Progress in Organic Coatings
Progress in Organic Coatings 工程技术-材料科学:膜
CiteScore
11.40
自引率
15.20%
发文量
577
审稿时长
48 days
期刊介绍: The aim of this international journal is to analyse and publicise the progress and current state of knowledge in the field of organic coatings and related materials. The Editors and the Editorial Board members will solicit both review and research papers from academic and industrial scientists who are actively engaged in research and development or, in the case of review papers, have extensive experience in the subject to be reviewed. Unsolicited manuscripts will be accepted if they meet the journal''s requirements. The journal publishes papers dealing with such subjects as: • Chemical, physical and technological properties of organic coatings and related materials • Problems and methods of preparation, manufacture and application of these materials • Performance, testing and analysis.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信