Encapsulated solid-liquid dual continuous pathways with low modulus and high thermal conductivity for dynamic target autonomous thermal management

Abstract

Materials that exhibit both high thermal conductivity and soft elasticity are essential for effective thermal management in complex dynamic environments. Additionally, these materials can serve as sensing layers to interact with external conditions. However, materials that possess high thermal conductivity often have a high modulus, which limits their soft elasticity. In this study, we introduce a novel solid-liquid dual-oriented pathway embedded in modified PDMS. This design incorporates continuous liquid metal pathways and vertically aligned graphene, allowing for the optimal utilization of their high thermal conductivity, low modulus, and excellent resilience. The resulting LM-VGA/mPDMS composites exhibit impressive thermal conductivity (κ_⊥ = 7.32 Wm^–1K⁻¹) alongside soft elasticity and a remarkably low elastic modulus of 71.14 kPa. The LM-VGA/mPDMS composite facilitates effective thermal management in both dynamic and static conditions. Furthermore, the LM-VGA/mPDMS composites function as non-contact, self-powered sensors capable of accurately detecting object positions and states, making them suitable for dynamic target autonomous thermal management.