Unraveling the new role of La on arc erosion behavior of C/Cu-based electrical contacts

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2024-11-07 DOI:10.1016/j.matlet.2024.137669

Bingtian Li , Ziyao Chen , ZhenJie Guan , Runchen Yang , Weijian Li , Liang Zhen , Wenzhu Shao

引用次数: 0

Abstract

Copper/carbon (C/Cu) electrical contact materials are widely used in low-voltage appliances due to their exceptional conductivity and anti-ablation properties. However, the oxidation of Cu during operation and the suboptimal wettability at the C/Cu interface negatively impact its arc-resistant performance. This study explores the potential for enhancing the arc-resistant characteristics of C/Cu electrical contact materials through the alloying of La in Cu. The findings indicate that La alloying in Cu significantly decreases the contact resistance (from 50 mΩ to 2.2 mΩ) and mass loss (by 50%) of C/Cu electrical contact materials.

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揭示 La 对 C/Cu 基电触头电弧侵蚀行为的新作用

铜/碳（C/Cu）电触点材料因其优异的导电性和抗烧蚀性能而广泛应用于低压电器中。然而，铜在工作过程中会发生氧化，C/Cu 接口的润湿性也不理想，这对其耐电弧性能产生了负面影响。本研究探讨了通过在铜中合金化 La 来提高 C/Cu 电接触材料耐电弧性能的潜力。研究结果表明，在铜中加入 La 合金可显著降低 C/Cu 电接触材料的接触电阻（从 50 mΩ 降至 2.2 mΩ）和质量损失（50%）。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive