{"title":"A novel sub-windowing local binary pattern approach for dorsal finger creases based biometric classification system","authors":"Imran Riaz , Ahmad Nazri Ali , Haidi Ibrahim","doi":"10.1016/j.jestch.2024.101882","DOIUrl":null,"url":null,"abstract":"<div><div>Biometric authentication systems have been widely deployed in various applications, including security systems, bank transactions and authentication on smart electronic devices. Obtaining the salient and distinctive features is very important for achieving high accuracy in biometric authentication systems. Local binary pattern (LBP) variants are the best-performing local descriptors and are popular due to computational simplicity and flexibility. However, most of the existing LBP variants consider a 3 × 3 window with one specific central pixel for all neighborhoods, which affects the sensitivity to non-monotonic intensity changes and reduces the robustness of the feature description. Thus, a new variant of LBP called TD-LBP is introduced, which is based on the four T-shape sub-windows and two diagonal (D) regions. Inspired by the sub-windowing approach to capture the microstructure information of the image, TD-LBP first divides the 3 × 3-pixel window into four sub-regions of T-shape structure and then takes two diagonal regions to extract more texture information. Three different classifiers, artificial neural network (ANN), support vector machine (SVM), and k-nearest neighbor (KNN) are employed to evaluate the effectiveness of the proposed approach for dorsal finger crease biometric system. Experiments conducted on the self-collected dorsal finger crease dataset demonstrate the prominent performance and suitability of the proposed TD-LBP for a newly explored finger crease biometric identifier. The proposed approach was able to achieve 96.67 %, 89.26 %, and 82.22 % classification accuracies for ANN, SVM, and KNN classifiers, respectively. Moreover, we clearly validate the viability of the proposed TD-LBP descriptor for the dorsal finger crease biometric trait by comparing the results with state-of-the-art biometric system based LBP descriptors. The significance of the TD-LBP method is demonstrated with improved verification and identification results through receiver operating characteristic (ROC) and cumulative match characteristic (CMC) curves respectively.</div></div>","PeriodicalId":48609,"journal":{"name":"Engineering Science and Technology-An International Journal-Jestech","volume":"60 ","pages":"Article 101882"},"PeriodicalIF":5.1000,"publicationDate":"2024-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Engineering Science and Technology-An International Journal-Jestech","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2215098624002684","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Biometric authentication systems have been widely deployed in various applications, including security systems, bank transactions and authentication on smart electronic devices. Obtaining the salient and distinctive features is very important for achieving high accuracy in biometric authentication systems. Local binary pattern (LBP) variants are the best-performing local descriptors and are popular due to computational simplicity and flexibility. However, most of the existing LBP variants consider a 3 × 3 window with one specific central pixel for all neighborhoods, which affects the sensitivity to non-monotonic intensity changes and reduces the robustness of the feature description. Thus, a new variant of LBP called TD-LBP is introduced, which is based on the four T-shape sub-windows and two diagonal (D) regions. Inspired by the sub-windowing approach to capture the microstructure information of the image, TD-LBP first divides the 3 × 3-pixel window into four sub-regions of T-shape structure and then takes two diagonal regions to extract more texture information. Three different classifiers, artificial neural network (ANN), support vector machine (SVM), and k-nearest neighbor (KNN) are employed to evaluate the effectiveness of the proposed approach for dorsal finger crease biometric system. Experiments conducted on the self-collected dorsal finger crease dataset demonstrate the prominent performance and suitability of the proposed TD-LBP for a newly explored finger crease biometric identifier. The proposed approach was able to achieve 96.67 %, 89.26 %, and 82.22 % classification accuracies for ANN, SVM, and KNN classifiers, respectively. Moreover, we clearly validate the viability of the proposed TD-LBP descriptor for the dorsal finger crease biometric trait by comparing the results with state-of-the-art biometric system based LBP descriptors. The significance of the TD-LBP method is demonstrated with improved verification and identification results through receiver operating characteristic (ROC) and cumulative match characteristic (CMC) curves respectively.
期刊介绍:
Engineering Science and Technology, an International Journal (JESTECH) (formerly Technology), a peer-reviewed quarterly engineering journal, publishes both theoretical and experimental high quality papers of permanent interest, not previously published in journals, in the field of engineering and applied science which aims to promote the theory and practice of technology and engineering. In addition to peer-reviewed original research papers, the Editorial Board welcomes original research reports, state-of-the-art reviews and communications in the broadly defined field of engineering science and technology.
The scope of JESTECH includes a wide spectrum of subjects including:
-Electrical/Electronics and Computer Engineering (Biomedical Engineering and Instrumentation; Coding, Cryptography, and Information Protection; Communications, Networks, Mobile Computing and Distributed Systems; Compilers and Operating Systems; Computer Architecture, Parallel Processing, and Dependability; Computer Vision and Robotics; Control Theory; Electromagnetic Waves, Microwave Techniques and Antennas; Embedded Systems; Integrated Circuits, VLSI Design, Testing, and CAD; Microelectromechanical Systems; Microelectronics, and Electronic Devices and Circuits; Power, Energy and Energy Conversion Systems; Signal, Image, and Speech Processing)
-Mechanical and Civil Engineering (Automotive Technologies; Biomechanics; Construction Materials; Design and Manufacturing; Dynamics and Control; Energy Generation, Utilization, Conversion, and Storage; Fluid Mechanics and Hydraulics; Heat and Mass Transfer; Micro-Nano Sciences; Renewable and Sustainable Energy Technologies; Robotics and Mechatronics; Solid Mechanics and Structure; Thermal Sciences)
-Metallurgical and Materials Engineering (Advanced Materials Science; Biomaterials; Ceramic and Inorgnanic Materials; Electronic-Magnetic Materials; Energy and Environment; Materials Characterizastion; Metallurgy; Polymers and Nanocomposites)