Effect of grain size and orientation on magnetron sputtering yield of tantalum

IF 4.2 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

International Journal of Refractory Metals & Hard Materials Pub Date : 2024-11-02 DOI:10.1016/j.ijrmhm.2024.106948

Kai Yu , Xin Xue , Longfei Xu , Guipeng Li , Xiaodan Zhang , Yuhui Wang

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引用次数: 0

Abstract

The electron beam melting (EBM) technique was employed to prepare ultra-highly pure (99.999 wt%) Tantalum (Ta) cast ingot for application in chips. Subsequently, the Ta cast ingot were forged, rolled, and annealed with different durations to gain three different grain sizes (centimeter scale, 99.8 μm, and 36.7 μm). Sputtering experiments conducted under identical conditions revealed that the rolled target (36.7 μm) film deposition rate was increased by 60.6 % compared to the cast ingot target with a centimeter-scale grain size (columnar crystal). Ta targets with a fine grain size and homogeneous distribution demonstrate superior film deposition performance. The sputtering rate is directly related to the atomic packing density of grains. The (111)-oriented grains of BCC targets (Ta target) exhibit sputtering resistance, and the order of sputtering rate of Ta atoms was S₍₁₀₁₎ > S₍₀₀₁₎ > S₍₁₁₁₎.

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晶粒尺寸和取向对磁控溅射钽成品率的影响

采用电子束熔炼（EBM）技术制备了超高纯（99.999 wt%）钽（Ta）铸锭，用于芯片。随后，对钽铸锭进行锻造、轧制和不同持续时间的退火，以获得三种不同的晶粒大小（厘米级、99.8 μm 和 36.7 μm）。在相同条件下进行的溅射实验表明，与具有厘米级晶粒大小（柱状晶）的铸锭靶相比，轧制靶（36.7 μm）的薄膜沉积率提高了 60.6%。晶粒尺寸细小、分布均匀的 Ta 靶件显示出卓越的薄膜沉积性能。溅射速率与晶粒的原子堆积密度直接相关。BCC 靶件（Ta 靶件）的（111）取向晶粒具有溅射阻力，Ta 原子的溅射率顺序为 S(101) > S(001) > S(111)。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

$International Journal of Refractory Metals & Hard Materials$

International Journal of Refractory Metals & Hard Materials 工程技术-材料科学：综合

CiteScore

7.00

自引率

13.90%

发文量

236

审稿时长

35 days

期刊介绍： The International Journal of Refractory Metals and Hard Materials (IJRMHM) publishes original research articles concerned with all aspects of refractory metals and hard materials. Refractory metals are defined as metals with melting points higher than 1800 °C. These are tungsten, molybdenum, chromium, tantalum, niobium, hafnium, and rhenium, as well as many compounds and alloys based thereupon. Hard materials that are included in the scope of this journal are defined as materials with hardness values higher than 1000 kg/mm2, primarily intended for applications as manufacturing tools or wear resistant components in mechanical systems. Thus they encompass carbides, nitrides and borides of metals, and related compounds. A special focus of this journal is put on the family of hardmetals, which is also known as cemented tungsten carbide, and cermets which are based on titanium carbide and carbonitrides with or without a metal binder. Ceramics and superhard materials including diamond and cubic boron nitride may also be accepted provided the subject material is presented as hard materials as defined above.