Parametric study for thermal uniformity analysis on vertical fin located in novel designed impacting-jet double-layer nested microchannel heat sinks verified by SLM 3D printing method

Abstract

The design of impacting-jet double-layer nested microchannel heat sinks (IJDN-MHS) has been proved to be an effective structure on heat dissipation improvement in electronic components. In order to achieve ideal substrate thermal uniformity for IJDN-MHS, the position research on vertical fin connecting inner/outer cooling circuit in IJDN-MHS has been studied numerically. Moreover, 3D printing test samples are made on the purpose of experimental verification using selective laser melting printing technology. As a result of the analysis, there is a strong correlation between the results of the numerical simulation and the experimental results. Through numerical simulation, it has been determined that the center fin position should be optimized for achieving the best thermal uniformity on the substrate. The model of distance between vertical fin connecting inner/outer cooling circuit and central point in IJDM-MHS equaling 0.27 mm (IJDN-MHS_0.27) has shown the optimal thermal symmetry on substrate. Further, with the streaming fins length increasing to 0.7 mm on the both sides of the vertical fin connecting inner/outer cooling circuit, thermal gradient at the bottom can be significantly controlled, and the peak temperature on substrate also drop to its most extreme limit based on the thermal uniformity on substrate.