Linhan Jing, Fa Luo, Haijun Pan, Liuchao Zhang, Lechun Deng, Yulong Xue, Xinyi Wang
{"title":"The dielectric adjustment in SiCf/mullite composites limited carbon content by in situ growth SiO2 layer","authors":"Linhan Jing, Fa Luo, Haijun Pan, Liuchao Zhang, Lechun Deng, Yulong Xue, Xinyi Wang","doi":"10.1007/s10854-024-13772-1","DOIUrl":null,"url":null,"abstract":"<div><p>\nRecently, SiC-continued fiber-reinforced ceramic matrix composites were widely used in high-temperature absorbing materials. However, the excessive carbon content indicated the deteriorative absorbing property. To solve the impedance mismatching of the SiC matrix and increase the charge accumulation at the multi-phase interface, SiC<sub>f</sub>/mullite composites were prepared in this paper by using the sol–gel method. The introduction of mullite matrix without free carbon improved impedance matching characteristics. The strong bonding between the in situ grown SiO<sub>2</sub> layer and the mullite matrix caused by high temperature induced the Maxwell–Wagner effect, which effectively optimized the absorbing performance. The complex dielectric constant of the composite increased with higher sintering temperatures. The highest reflection loss reached − 23.1 dB at the sintering temperature of 1100 °C. With the two-step drying process, the porosity was reduced to 16.1% and the density increased. The crystallinity and density of the mullite matrix increased in the rising sintering temperatures, with the highest bending strength reaching 157.89 MPa for composites sintered at 1100 °C.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"35 33","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2024-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-024-13772-1","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Recently, SiC-continued fiber-reinforced ceramic matrix composites were widely used in high-temperature absorbing materials. However, the excessive carbon content indicated the deteriorative absorbing property. To solve the impedance mismatching of the SiC matrix and increase the charge accumulation at the multi-phase interface, SiCf/mullite composites were prepared in this paper by using the sol–gel method. The introduction of mullite matrix without free carbon improved impedance matching characteristics. The strong bonding between the in situ grown SiO2 layer and the mullite matrix caused by high temperature induced the Maxwell–Wagner effect, which effectively optimized the absorbing performance. The complex dielectric constant of the composite increased with higher sintering temperatures. The highest reflection loss reached − 23.1 dB at the sintering temperature of 1100 °C. With the two-step drying process, the porosity was reduced to 16.1% and the density increased. The crystallinity and density of the mullite matrix increased in the rising sintering temperatures, with the highest bending strength reaching 157.89 MPa for composites sintered at 1100 °C.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.